参数资料
型号: ISL54065EVAL1Z
厂商: Intersil
文件页数: 7/15页
文件大小: 0K
描述: EVALUATION BOARD FOR ISL54065
标准包装: 1
主要目的: 接口,2:1 多路复用器
嵌入式:
已用 IC / 零件: ISL54065
主要属性: 2 x SPDT 模拟开关
次要属性: 1.8 V ~ 6.5 V 电源
已供物品:
15
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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FN6583.2
November 3, 2009
ISL54065
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
6
B
E
A
D
0.10 C
2X
INDEX AREA
2
1
N
NX (b)
SECTION "C-C"
e
CC
5
CL
TERMINAL TIP
(A1)
L
0.10 C
2X
C
0.05 C
A
0.10 C
A1
LEADS COPLANARITY
0.10 M C A B
0.05 M C
PIN #1 ID
5
(DATUM B)
(DATUM A)
NX L
Nd
Ne
3
e
NX b
12
BOTTOM VIEW
SIDE VIEW
TOP VIEW
10
2.30
0.40
0.45 (12x)
1.50
1
2
3
0.25 (12x)
0.40
TYPICAL RECOMMENDED LAND PATTERN
L12.2.2x1.4A
12 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.45
0.50
0.55
-
A1
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.15
2.20
2.25
-
E
1.35
1.40
1.45
-
e
0.40 BSC
-
k0.20
-
L
0.35
0.40
0.45
-
N12
2
Nd
3
Ne
3
θ
0-
12
4
Rev. 0 12/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side, re-
spectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be ei-
ther a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. Same as JEDEC MO-255UABD except:
No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm
"L" MAX dimension = 0.45 not 0.42mm.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
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