参数资料
型号: ISL54225IRTZEVAL1Z
厂商: Intersil
文件页数: 13/18页
文件大小: 0K
描述: BOARD EVAL FOR ISL5425A MUX
标准包装: 1
主要目的: 接口,USB 2.0 开关
嵌入式:
已用 IC / 零件: ISL54225
主要属性: 2 通道
次要属性: 2.7 V ~ 5.25 V 电源
已供物品:
4
FN7627.0
July 2, 2010
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
VDD to Dx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5V
Dx to HSD1x, HSD2x . . . . . . . . . . . . . . . . . . . . . . . . .8.6V
Input Voltages
HSD2x, HSD1x . . . . . . . . . . . . . . . . . . . . . - 0.3V to 6.5V
SEL, OE . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
Output Voltages
D+, D- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5V to 6.5V
Continuous Current (HSD2x, HSD1x) . . . . . . . . . . . .±40mA
Peak Current (HSD2x, HSD1x)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . ±100mA
ESD Rating:
Human Body Model (Tested per JESD22-A114-F) . . .>5.5kV
Machine Model (Tested per JESD22-A115-A). . . . . . . >250V
Charged Device Model (Tested per JESD22-C101-D) . . >2kV
Latch-up Tested per JEDEC; Class II Level A . . . . . at +85°C
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
10 Ld TQFN Package (Note 6, 7) .
210
165
10 Ld TDFN Package (Notes 8, 9). .
58
22
Maximum Junction Temperature (Plastic Package). . +150°C
Maximum Storage Temperature Range . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
VDD Supply Voltage Range . . . . . . . . . . . . . . 2.7V to 5.25V
Logic Control Input Voltage . . . . . . . . . . . . . . . 0V to 5.25V
Analog Signal Range
VDD = 2.7V to 5.25V . . . . . . . . . . . . . . . . . . . 0V to 3.6V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
7. For θJC, the “case temp” location is taken at the package top center.
8. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
9. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: VDD = +3.3V, GND = 0V, VSELH = 1.4V,
VSELL = 0.5V, VOEH =1.4V, VOEL = 0.5V, (Note 10), Unless
Otherwise Specified. Boldface limits apply over the operating
temperature range, -40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
(Notes 11, 12) TYP
MAX
(Notes 11, 12) UNITS
ANALOG SWITCH CHARACTERISTICS
ON-Resistance, rON
(High-Speed)
VDD = 2.7V, SEL = 0.5V or 1.4V, OE =0.5V,
IDx = 17mA, VHSD1x or VHSD2x = 0V to 400mV
(see Figure 3, Note 15)
25
-
6.5
8
Ω
Full
-
10
Ω
rON Matching Between
Channels, ΔrON
(High-Speed)
VDD = 2.7V, SEL = 0.5V or 1.4V, OE =0.5V,
IDx = 17mA, VHSD1x or VHSD2x = Voltage at
max rON, (Notes 14, 15)
25
-
0.2
0.45
Ω
Full
-
0.5
Ω
rON Flatness, RFLAT(ON)
(High-Speed)
VDD = 2.7V, SEL = 0.5V or 1.4V, OE =0.5V,
IDx = 17mA, VHSD1x or VHSD2x = 0V to 400mV,
(Notes 13, 15)
25
-
0.3
0.5
Ω
Full
-
1
Ω
ON-Resistance, rON
VDD = 3.3V, SEL = 0.5V or 1.4V, OE =0.5V,
ICOMx = 17mA, VD+ or VD-= 3.3V (See Figure 4,
Note 15)
25
-
12
20
Ω
Full
-
25
Ω
OFF Leakage Current,
IHSD1x(OFF)
VDD = 5.25V, SEL = VDD and OE = VDD or
OE = 0V, VDx = 0.3V, 3.3V, VHSD1x =3.3V,
0.3V, VHSD2x = 0.3V, 3.3V
25
-20
1
20
nA
Full
-
30
-
nA
ON Leakage Current,
IHSD1x(ON)
VDD = 5.25V, SEL = OE = 0V, VDx =0.3V, 3.3V,
VHSD1X = 0.3V, 3.3V, VHSD2x = 3.3V, 0.3V
25
-
2
3
A
Full
-
4
A
OFF Leakage Current,
IHSD2x(OFF)
VDD = 5.25V, SEL = OE = 0V or OE = VDD,
VDx = 3.3V, 0.3V, VHSD2x = 0.3V, 3.3V,
VHSD1X = 3.3V, 0.3V
25
-20
1
20
nA
Full
-
30
-
nA
ISL54225
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