ISL54228
4
FN7628.0
July 29, 2010
Absolute Maximum Ratings
Thermal Information
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
VDD to COMx. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5V
COMx to Dx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8.6V
Input Voltages
D+, D- . . . . . . . . . . . . . . . . . . . . . . . . . . - 0.3V to 6.5V
COM+, COM- . . . . . . . . . . . . . . . . . . . . . . . - 5V to 6.5V
OE, LP . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
Continuous Current (COM-/D-, COM+/D+) . . . . . . . ±40mA
Peak Current (COM-/D-, COM+/D+)
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . ±100mA
ESD Rating:
Human Body Model (Tested per JESD22-A114-F). . . . >2kV
Machine Model (Tested per JESD22-A115-A) . . . . . . >150V
Charged Device Model (Tested per JESD22-C101-D) . >2kV
Latch-up Tested per JEDEC; Class II Level A . . . . . at +85°C
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
8 Ld TQFN Package (Note
6, 8) . .
210
165
8 Ld TDFN Package (Notes
5, 7). . .
96
19
Maximum Junction Temperature (Plastic Package). . +150°C
Maximum Storage Temperature Range. . . . . -65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Normal Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40°C to +85°C
VDD Supply Voltage Range . . . . . . . . . . . . . . 2.7V to 5.25V
Logic Control Input Voltage . . . . . . . . . . . . . . . 0V to 5.25V
Analog Signal Range
VDD = 2.7V to 5.25V . . . . . . . . . . . . . . . . . . . 0V to 3.6V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact
product reliability and result in failures not covered by warranty.
NOTES:
5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach”
features. See Tech Brief TB379.
6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
TB379 for details.
7. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
8. For θJC, the “case temp” location is taken at the package top center.
Electrical Specifications - 2.7V to 5.25V Supply Test Conditions: VDD = +3.3V, GND = 0V, VLP = GND,
VOEH =1.4V, VOEL = 0.5V, (Note 9), Unless Otherwise Specified. Boldface limits apply over the operating temperature range, -40°C to +85°C.
PARAMETER
TEST CONDITIONS
TEMP
(°C)
MIN
MAX
ANALOG SWITCH CHARACTERISTICS
ON-Resistance, rON
(High-Speed)
VDD = 2.7V, OE = 1.4V, IDx = 17mA,
VCom+ or VCOM- = 0V to 400mV
25
-
3.5
5
Ω
Full
-
7
Ω
rON Matching Between
Channels, ΔrON (High-Speed)
VDD = 2.7V, OE = 1.4V, IDx = 17mA,
VCom+ or VCOM- = Voltage at max rON,
25
-
0.2
0.45
Ω
Full
-
0.55
Ω
rON Flatness, RFLAT(ON)
(High-Speed)
VDD = 2.7V, OE = 1.4V, IDx = 17mA,
VCom+ or VCOM- = 0V to 400mV
25
-
0.26
1
Ω
Full
-
1.2
Ω
ON-Resistance, rON
VDD = 3.3V, OE = 1.4V, ICOMx = 17mA,
VCom+ or VCOM- = 3.3V
+25
-
6.8
17
Ω
Full
-
22
Ω
OFF Leakage Current, IDx(OFF) VDD = 5.25V, OE = 0V, VDx =0.3V, 3.3V,
VCOMX = 3.3V, 0.3V
25
-20
1
20
nA
Full
-
30
-
nA
ON Leakage Current, IDx(ON) VDD = 5.25V, OE = 5.25V, VDx = 0.3V,
3.3V, VCOMX = 0.3V, 3.3V
25
-9
-
9
A
Full
-12
-
12
A
Power OFF Leakage Current,
ICOM+, ICOM-
VDD = 0V, VCOM+ = 5.25V, VCOM- = 5.25V,
OE = 0V
25
-
11
A
Power OFF Logic Current, IOE VDD = 0V, OE = 5.25V
25
-
22
A
Power OFF D+/D- Current,
ID+, ID-
VDD = 0V, OE = VDD, VD+ = VD- = 5.25V 25
-
1
A
ISL54228