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参数资料
| 型号： | ISL5585ECR-TK |
| 厂商： | Intersil |
| 文件页数： | 16/24页 |
| 文件大小： | 0K |
| 描述： | IC SLIC RINGING 3.3V VOB 32-QFN |
| 标准包装： | 1,000 |
| 功能： | 用户线路接口概念（SLIC） |
| 电路数： | 1 |
| 电源电压： | 3.3V |
| 功率（瓦特）： | 305mW |
| 工作温度： | 0°C ~ 75°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VQFN 裸露焊盘 |
| 供应商设备封装： | 32-QFN（7x7） |
| 包装： | 带卷 (TR) |
| 包括： | 均衡和不均衡振铃，振铃声信号发生器，热关机，带警报指示器 |
23
ISL5585
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
INDEX
D1/2
D1
D/2
D
E1/2
E/2
E
A
2X
0.15
B
C
0.10
B
A
MC
A
N
SEATING PLANE
N
6
3
2
3
e
1
0.08
FOR ODD TERMINAL/SIDE
FOR EVEN TERMINAL/SIDE
C
SECTION "C-C"
NX b
A1
C
2X
C
0.15
2X
B
0
REF.
(Nd-1)Xe
(Ne-1)Xe
REF.
5
A1
4X P
A
C
4X P
B
2X
A
C
0.15
A2
A3
D2
E2
E2/2
TERMINAL TIP
SIDE VIEW
TOP VIEW
7
BOTTOM VIEW
7
5
C
L
C
L
e
E1
2
NX k
NX b
8
NX L
8
9
AREA
9
4X
0.10 C
/ /
9
(DATUM B)
(DATUM A)
AREA
INDEX
6
AREA
N
9
CORNER
OPTION 4X
L1
L
10
L1
L
10
L32.7x7
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VKKC ISSUE C)
SYMBOL
MILLIMETERS
NOTES
MIN
TYP
MAX
A
0.80
0.90
1.00
-
A1
-
0.05
-
A2
-
1.00
9
A3
0.20 REF
9
b
0.23
0.28
0.38
5, 8
D
7.00 BSC
-
D1
6.75 BSC
9
D2
4.55
4.70
4.85
7, 8
E
7.00 BSC
-
E1
6.75 BSC
9
E2
4.55
4.70
4.85
7, 8
e
0.65 BSC
-
k
0.25
---
L
0.50
0.60
0.75
8
L1
-
0.15
10
N32
2
Nd
8
3
Ne
8
3
P-
-
0.60
9
θ
--
12
9
Rev. 4 8/03
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present
when Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
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相关代理商/技术参数 |
参数描述 |
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| ISL5585ECRZ | 制造商:Intersil Corporation 功能描述:PB-FREE RINGING SLIC W/3.3V VCC, 75V/53DB - Rail/Tube 制造商:Intersil 功能描述:RINGING SLIC W/3 3V VCC 75V/53DB |
| ISL5585ECRZ-T | 制造商:Intersil Corporation 功能描述:SLIC 1CH 64DB 45MA 3.3V/-18V/-24V/-28V 32QFN EP - Tape and Reel 制造商:Intersil 功能描述:RINGING SLIC W/3 3V VCC 75V/53DB |
| ISL5585ECRZ-TK | 功能描述:IC SLIC RINGING 3.3V VOB 32-QFN RoHS:是 类别:集成电路 (IC) >> 接口 - 电信 系列:- 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 06/Feb/2012 标准包装:750 系列:* |
| ISL5585EVAL4 | 制造商:Intersil Corporation 功能描述:ISL5585 EVALUATION BOARD 4 - Bulk |
| ISL5585FCM | 制造商:Rochester Electronics LLC 功能描述: 制造商:Intersil Corporation 功能描述: |
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