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参数资料
| 型号： | ISL5829INZ |
| 厂商： | Intersil |
| 文件页数： | 13/13页 |
| 文件大小： | 0K |
| 描述： | IC CONV DUAL 12BIT 3.3V 48-LQFP |
| 标准包装： | 250 |
| 功能： | D/A 转换器 |
| RF 型： | 手机，GSM，EDGE，WCDMA |
| 次要属性： | 双路 12 位 |
| 封装/外壳： | 48-LQFP |
| 包装： | 托盘 |
ISL5829
Thin Plastic Quad Flatpack Packages (LQFP)
D
D1
-D-
Q48.7x7A (JEDEC MS-026BBC ISSUE B)
48 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
INCHES
MILLIMETERS
SYMBOL
A
A1
MIN
-
0.002
MAX
0.062
0.005
MIN
-
0.05
MAX
1.60
0.15
NOTES
-
-
E E1
-A-
-B-
e
A2
b
b1
D
D1
E
E1
L
0.054
0.007
0.007
0.350
0.272
0.350
0.272
0.018
0.057
0.010
0.009
0.358
0.280
0.358
0.280
0.029
1.35
0.17
0.17
8.90
6.90
8.90
6.90
0.45
1.45
0.27
0.23
9.10
7.10
9.10
7.10
0.75
-
6
-
3
4, 5
3
4, 5
-
PIN 1
N
48
48
7
-H-
A
SEATING
PLANE
e
0.020 BSC
0.50 BSC
-
Rev. 2 1/99
NOTES:
-C-
0.08
0.003
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
11 o -13 o
0.08
0.003 M
C A-B S
D S
b
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
GAGE
PLANE
0.020
0.008 MIN
0 o MIN
0.09/0.16
A2 A1 0.004/0.006
BASE METAL
b1
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003
inch).
0 o -7 o
0.25
0.010
L
11 o -13 o
WITH PLATING
0.09/0.20
0.004/0.008
7. “N” is the number of terminal positions.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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