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参数资料
| 型号： | ISL5957IA |
| 厂商： | INTERSIL CORP |
| 元件分类： | DAC |
| 英文描述： | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| 中文描述： | PARALLEL, WORD INPUT LOADING, 14-BIT DAC, PDSO28 |
| 封装： | PLASTIC, MS-153-AE, TSSOP-28 |
| 文件页数： | 12/13页 |
| 文件大小： | 630K |
| 代理商： | ISL5957IA |
12
FN6080.1
November 12, 2004
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
μ
α
0.25(0.010)
B
M
M
M28.3
(JEDEC MS-013-AE ISSUE C
)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0926
0.1043
2.35
2.65
-
A1
0.0040
0.0118
0.10
0.30
-
B
0.013
0.0200
0.33
0.51
9
C
0.0091
0.0125
0.23
0.32
-
D
0.6969
0.7125
17.70
18.10
3
E
0.2914
0.2992
7.40
7.60
4
e
0.05 BSC
1.27 BSC
-
H
0.394
0.419
10.00
10.65
-
h
0.01
0.029
0.25
0.75
5
L
0.016
0.050
0.40
1.27
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 12/93
ISL5957
相关PDF资料 |
PDF描述 |
|---|---|
| ISL5957IAZ | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IB | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IBZ | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957EVAL1 | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5961EVAL1 | 14-Bit, +3.3V, 130/210MSPS, CommLinkTM High Speed D/A Converter |
相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL5957IAZ | 功能描述:CONV D/A 14-BIT 3.3V 28-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散（最大）:941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压，单极 采样率（每秒）:* |
| ISL5957IB | 功能描述:IC DAC 14-BIT 260MHZ 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| ISL5957IBZ | 功能描述:数模转换器- DAC 14-BIT DAC 260MHZ ’-40/+85C 2 8LD RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| ISL59601 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:MegaQ: An Automatic Composite Video Equalizer, Fully-Adaptive to 1 Mile (1600m) |
| ISL59601IRZ | 功能描述:IC VIDEO EQUALIZER 20QFN RoHS:是 类别:集成电路 (IC) >> 线性 - 视频处理 系列:MegaQ™ 产品变化通告:Product Discontinuation 07/Mar/2011 标准包装:3,000 系列:OMNITUNE™ 类型:调谐器 应用:移动电话，手机，视频显示器 安装类型:表面贴装 封装/外壳:65-WFBGA 供应商设备封装:PG-WFSGA-65 包装:带卷 (TR) 其它名称:SP000365064 |
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