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参数资料
| 型号： | ISL5957IA |
| 厂商： | INTERSIL CORP |
| 元件分类： | DAC |
| 英文描述： | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| 中文描述： | PARALLEL, WORD INPUT LOADING, 14-BIT DAC, PDSO28 |
| 封装： | PLASTIC, MS-153-AE, TSSOP-28 |
| 文件页数： | 13/13页 |
| 文件大小： | 630K |
| 代理商： | ISL5957IA |
13
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN6080.1
November 12, 2004
ISL5957
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
1
2
3
-B-
0.10(0.004)
C A
M
B S
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 6/98
相关PDF资料 |
PDF描述 |
|---|---|
| ISL5957IAZ | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IB | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957IBZ | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5957EVAL1 | 14-Bit, +3.3V, 260+MSPS, High Speed D/A Converter |
| ISL5961EVAL1 | 14-Bit, +3.3V, 130/210MSPS, CommLinkTM High Speed D/A Converter |
相关代理商/技术参数 |
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|---|---|
| ISL5957IAZ | 功能描述:CONV D/A 14-BIT 3.3V 28-TSSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1,000 系列:- 设置时间:1µs 位数:8 数据接口:串行 转换器数目:8 电压电源:双 ± 功率耗散（最大）:941mW 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-SOIC（0.295"，7.50mm 宽） 供应商设备封装:24-SOIC W 包装:带卷 (TR) 输出数目和类型:8 电压，单极 采样率（每秒）:* |
| ISL5957IB | 功能描述:IC DAC 14-BIT 260MHZ 28-SOIC RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 标准包装:2,400 系列:- 设置时间:- 位数:18 数据接口:串行 转换器数目:3 电压电源:模拟和数字 功率耗散（最大）:- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:36-TFBGA 供应商设备封装:36-TFBGA 包装:带卷 (TR) 输出数目和类型:* 采样率（每秒）:* |
| ISL5957IBZ | 功能描述:数模转换器- DAC 14-BIT DAC 260MHZ ’-40/+85C 2 8LD RoHS:否 制造商:Texas Instruments 转换器数量:1 DAC 输出端数量:1 转换速率:2 MSPs 分辨率:16 bit 接口类型:QSPI, SPI, Serial (3-Wire, Microwire) 稳定时间:1 us 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-14 封装:Tube |
| ISL59601 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:MegaQ: An Automatic Composite Video Equalizer, Fully-Adaptive to 1 Mile (1600m) |
| ISL59601IRZ | 功能描述:IC VIDEO EQUALIZER 20QFN RoHS:是 类别:集成电路 (IC) >> 线性 - 视频处理 系列:MegaQ™ 产品变化通告:Product Discontinuation 07/Mar/2011 标准包装:3,000 系列:OMNITUNE™ 类型:调谐器 应用:移动电话，手机，视频显示器 安装类型:表面贴装 封装/外壳:65-WFBGA 供应商设备封装:PG-WFSGA-65 包装:带卷 (TR) 其它名称:SP000365064 |
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