参数资料
型号: ISL59911IRZ-EVALZ
厂商: Intersil
文件页数: 4/17页
文件大小: 0K
描述: EVALUATION BOARD FOR ISL59911
标准包装: 1
ISL59911
12
FN7548.0
September 2, 2011
Power Dissipation
The ISL59911 is designed to operate with ±5V supply voltages.
The supply currents are tested in production and guaranteed to
be less than 140mA per channel. Operating at ±5V power supply,
the total power dissipation is shown by Equation 1:
Where:
PDMAX = Maximum power dissipation
VS = Supply voltage = 5V
IMAX = Maximum quiescent supply current = 140mA
VOUTMAX = Maximum output voltage swing of the
application = 2V
The 3 term comes from the number of channels
RL = Load resistance = 150Ω
PDMAX = 1.4W
θJA required for long term reliable operation can be calculated.
This is done using Equation 2:
Where:
TJ is the maximum junction temperature (+150°C)
TA is the maximum ambient temperature (+85°C)
For a 32 Ld QFN package in a proper layout PCB heatsinking
copper area, 31°C/W
θJA thermal resistance can be achieved. To
disperse the heat, the bottom heatspreader must be soldered to
the PCB. Heat flows through the heatspreader to the circuit board
copper, then spreads and converts to air. Thus the PCB copper
plane becomes the heatsink. This has proven to be a very
effective technique. A separate application note that details the
32 pin QFN PCB design considerations is available.
PDMAX
2VS
×
ISMAX 3VS
(
- VOUTMAX)
VOUTMAX
RL
------------------------
×
+
×
=
(EQ. 1)
θJA TJ TA
() PD
46
°C
() W
=
(EQ. 2)
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