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参数资料
| 型号： | ISL62392LOEVAL1Z |
| 厂商： | Intersil |
| 文件页数： | 19/21页 |
| 文件大小： | 0K |
| 描述： | EVALUATION BOARD FOR ISL62392LO |
| 标准包装： | 1 |
| 系列： | Robust Ripple Regulator™ (R³) |
| 主要目的： | DC/DC，LDO 步降 |
| 输出及类型： | 3，非隔离 |
| 输出电压： | 3.3V，5V，3.3V |
| 电流 - 输出： | 8A，8A，100mA |
| 输入电压： | 5.5 ~ 25 V |
| 稳压器拓扑结构： | 降压 |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | ISL62392 |
ISL62391, ISL62392, ISL62391C, ISL62392C
Where:
- I VALLEY is the difference of the DC component of the
Co
inductor current minus 1/2 of the inductor ripple current
- I PEAK is the sum of the DC component of the inductor
current plus 1/2 of the inductor ripple current
- t ON is the time required to drive the device into
saturation
PIN 4 (VCC)
PIN 18 (PVCC)
ISL6239
L2
L2 U2
Ci
- t OFF is the time required to drive the device into cut-off
Selecting The Bootstrap Capacitor
The selection of the bootstrap capacitor is written as
Equation 26:
LINE OF SYMMETRY
Ci
L1 U1
Δ V BOOT
Q g
C BOOT = ------------------------
(EQ. 26)
PGND PLANE
PHASE PLANES
VOUT PLANES
VIN PLANE
L1
Co
Where:
- Q g is the total gate charge required to turn on the
high-side MOSFET
- Δ V BOOT , is the maximum allowed voltage decay across
the boot capacitor each time the high-side MOSFET is
switched on
As an example, suppose the high-side MOSFET has a total
gate charge Q g , of 25nC at V GS = 5V, and a Δ V BOOT of
200mV. The calculated bootstrap capacitance is 0.125μF; for
a comfortable margin, select a capacitor that is double the
calculated capacitance. In this example, 0.22μF will suffice.
Use an X7R or X5R ceramic capacitor.
Layout Considerations
As a general rule, power should be on the bottom layer of
the PCB and weak analog or logic signals are on the top
layer of the PCB. The ground-plane layer should be adjacent
to the top layer to provide shielding. The ground plane layer
should have an island located under the IC, the
compensation components, and the FSET components. The
island should be connected to the rest of the ground plane
layer at one point.
FIGURE 30. SYMMETRIC LAYOUT GUIDE
Signal Ground and Power Ground
The bottom of the ISL62391, ISL62392, ISL62391C and
ISL62392C TQFN package is the signal ground (GND)
terminal for analog and logic signals of the IC. Connect the
GND pad of the ISL62391, ISL62392, ISL62391C and
ISL62392C to the island of ground plane under the top layer
using several vias for a robust thermal and electrical
conduction path. Connect the input capacitors, the output
capacitors, and the source of the lower MOSFETs to the
power ground plane.
PGND (Pin 19)
This is the return path for the pull-down of the LGATE
low-side MOSFET gate driver. Ideally, PGND should be
connected to the source of the low-side MOSFET with a
low-resistance, low-inductance path.
VIN (Pin 17)
The VIN pin should be connected close to the drain of the
high-side MOSFET, using a low resistance and low
VIAS TO
GROUND
PLANE
GND
OUTPUT
CAPACITORS
INDUCTOR
HIGH-SIDE
MOSFETS
NODE
VIN
LOW-SIDE
MOSFETS
INPUT
CAPACITORS
VIAS TO
GROUND
PLANE
INDUCTOR
HIGH-SIDE
MOSFETS
GND
VOUT
PHASE
NODE
VIN
OUTPUT
CAPACITORS
SCHOTTKY
DIODE
LOW-SIDE
MOSFETS
INPUT
CAPACITORS
inductance path.
VCC (Pin 4)
For best performance, place the decoupling capacitor very
close to the VCC and GND pins.
PVCC (Pin 18)
For best performance, place the decoupling capacitor very
close to the PVCC and respective PGND pin, preferably on
the same side of the PCB as the ISL62391, ISL62392,
FIGURE 29. TYPICAL POWER COMPONENT PLACEMENT
Because there are two SMPS outputs and only one PGND
pin, the power train of both channels should be laid out
symmetrically. The line of bilateral symmetry should be
drawn through pins 4 and 18. This layout approach ensures
that the controller does not favor one channel over another
during critical switching decisions. Figure 29 illustrates one
example of how to achieve proper bilateral symmetry.
19
ISL62391C and ISL62392C ICs.
EN (Pins 11 and 24), and PGOOD (Pin 1)
These are logic signals that are referenced to the GND pin.
Treat as a typical logic signal.
OCSET (Pins 10 and 25) and ISEN (Pins 9 and 26)
For DCR current sensing, the current-sense network,
consisting of R OCSET and C SEN , needs to be connected to
the inductor pads for accurate measurement. Connect
FN6666.7
August 22, 2013
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ISL6244 | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:Multi-Phase PWM Controller |
| ISL6244CR | 功能描述:IC REG CTRLR BUCK PWM 32-QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
| ISL6244CR-T | 功能描述:IC REG CTRLR BUCK PWM 32-QFN RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:4,000 系列:- PWM 型:电压模式 输出数:1 频率 - 最大:1.5MHz 占空比:66.7% 电源电压:4.75 V ~ 5.25 V 降压:是 升压:无 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 85°C 封装/外壳:40-VFQFN 裸露焊盘 包装:带卷 (TR) |
| ISL6244CRZ | 功能描述:电流型 PWM 控制器 VER OF ISL6244CR RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
| ISL6244CRZ-T | 功能描述:电流型 PWM 控制器 VER OF ISL6244CR-T RoHS:否 制造商:Texas Instruments 开关频率:27 KHz 上升时间: 下降时间: 工作电源电压:6 V to 15 V 工作电源电流:1.5 mA 输出端数量:1 最大工作温度:+ 105 C 安装风格:SMD/SMT 封装 / 箱体:TSSOP-14 |
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