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| 型号： | ISL6327CRZ-T |
| 厂商： | Intersil |
| 文件页数： | 22/29页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM 48-QFN |
| 标准包装： | 4,000 |
| PWM 型： | 控制器 |
| 输出数： | 6 |
| 频率 - 最大： | 1MHz |
| 占空比： | 25% |
| 电源电压： | 4.75 V ~ 5.25 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 48-VFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
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ISL6327
In order to obtain the correct current information, there
should be a way to correct the temperature impact on the
current sense component. ISL6327 provides two methods:
integrated temperature compensation and external
temperature compensation.
Integrated Temperature Compensation
When TCOMP voltage is equal or greater than VCC/15,
ISL6327 will utilize the voltage at TM and TCOMP pins to
compensate the temperature impact on the sensed current.
The block diagram of this function is shown in Figure 15.
TCOMP factor N is an integer between 0 and 15. The
integrated temperature compensation function is disabled for
N = 0. For N = 4, the NTC temperature is equal to the
temperature of the current sense component. For N <4, the
NTC is hotter than the current sense component. The NTC is
cooler than the current sense component for N >4. When
N >4, the larger TCOMP factor N, the larger the difference
between the NTC temperature and the temperature of the
current sense component.
ISL6327 multiplexes the TCOMP factor N with the TM digital
signal to obtain the adjustment gain to compensate the
temperature impact on the sensed channel current. The
V CC
I sen6
compensated channel current signal is used for droop and
overcurrent protection functions.
R TM1
TM
Non-linear
A/D
Channel current sense
I sen5
I sen4
I sen3
I sen2
Design Procedure
1. Properly choose the voltage divider for TM pin to match
the TM voltage vs temperature curve with the
o c
R NTC
I 6
I 5
I 4
I 3
I 2
I 1
I sen1
recommended curve in Figure 13.
2. Run the actual board under the full load and the desired
V CC
R TC1
TCOMP
D/A
4-bit
A/D
k i
Droop, Iout &
Over current protection
cooling condition.
3. After the board reaches the thermal steady state, record
the temperature (T CSC ) of the current sense component
(inductor) and the voltage at TM and VCC pins.
4. Use Equation 21 to calculate the resistance of the TM
NTC, and find out the corresponding NTC temperature
R NTC ( T ) = --------------------------------
V CC – V
TM
R TC2
FIGURE 15. BLOCK DIAGRAM OF INTEGRATED
T NTC from the NTC datasheet.
V TM xR TM1
NTC
(EQ. 21)
TEMPERATURE COMPENSATION
5. Use Equation 22 to calculate the TCOMP factor N:
209x ( T CSC – T
N = -------------------------------------------------------- + 4
When the TM NTC is placed close to the current sense
component (inductor), the temperature of the NTC will track
NTC
3xT NTC + 400
)
(EQ. 22)
R TC2 = ----------------------- (EQ. 23)
the temperature of the current sense component. Therefore,
the TM voltage can be utilized to obtain the temperature of
the current sense component.
Based on VCC voltage, ISL6327 converts the TM pin voltage
to a 6-bit TM digital signal for temperature compensation.
With the non-linear A/D converter of ISL6327, TM digital
signal is linearly proportional to the NTC temperature. For
accurate temperature compensation, the ratio of the TM
voltage to the NTC temperature of the practical design
should be similar to that in Figure 13.
Depending on the location of the NTC and the air-flowing,
the NTC may be cooler or hotter than the current sense
component. TCOMP pin voltage can be utilized to correct
the temperature difference between NTC and the current
sense component. When a different NTC type or different
voltage divider is used for the TM function, TCOMP voltage
can also be used to compensate for the difference between
the recommended TM voltage curve in Figure 14 and that of
the actual design. According to the VCC voltage, ISL6327
converts the TCOMP pin voltage to a 4-bit TCOMP digital
signal as TCOMP factor N.
22
6. Choose an integral number close to the above result for
the TCOMP factor. If this factor is higher than 15, use
N = 15. If it is less than 1, use N = 1.
7. Choose the pull-up resistor R TC1 (typical 10k Ω );
8. If N = 15, do not need the pull-down resistor R TC2 ,
otherwise obtain R TC2 using Equation 23:
NxR TC1
15 – N
9. Run the actual board under full load again with the proper
resistors to TCOMP pin.
10. Record the output voltage as V1 immediately after the
output voltage is stable with the full load; record the
output voltage as V2 after the VR reaches the thermal
steady state.
11. If the output voltage increases over 2mV as the
temperature increases, i.e. V2 - V1 >2mV, reduce N and
redesign R TC2 ; if the output voltage decreases over 2mV
as the temperature increases, i.e. V1 - V2 >2mV,
increase N and redesign R TC2 .
The design spreadsheet is available for those calculations.
FN9276.4
May 5, 2008
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