参数资料
型号: ISL6612IB
厂商: Intersil
文件页数: 11/12页
文件大小: 0K
描述: IC DRIVER MOSFET SYNC BUCK 8SOIC
标准包装: 98
配置: 高端和低端,同步
输入类型: PWM
延迟时间: 10ns
电流 - 峰: 1.25A
配置数: 1
输出数: 2
高端电压 - 最大(自引导启动): 36V
电源电压: 10.8 V ~ 13.2 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
ISL6612, ISL6613
Small Outline Exposed Pad Plastic Packages (EPSOIC)
N
M8.15B
INDEX
AREA
E
-B-
H
0.25(0.010) M
B M
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
1
2
3
A
0.056
0.066
1.43
1.68
-
TOP VIEW
SEATING PLANE
L
A1
B
C
D
E
0.001
0.0138
0.0075
0.189
0.150
0.005
0.0192
0.0098
0.196
0.157
0.03
0.35
0.19
4.80
3.81
0.13
0.49
0.25
4.98
3.99
-
9
-
3
4
-A-
D
A
h x 45 o
e
H
0.050 BSC
0.230
0.244
1.27 BSC
5.84
6.20
-
-
e
B
0.25(0.010) M
SIDE VIEW
-C-
C A M B S
A1
α
0.10(0.004)
C
h
L
N
α
P
P1
0.010
0.016
-
-
8
0.016
0.035
0.094
0.094
0.25
0.41
-
-
8
0.41
0.64
2.387
2.387
5
6
7
-
11
11
Rev. 4 1/09
NOTES:
1
2
3
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
N
P
BOTTOM VIEW
P1
11
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: INCH. Converted millimeter dimensions
are not necessarily exact.
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
variations. Values shown are maximum size of exposed pad
within lead count and body size.
FN9153.9
June 15, 2010
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