参数资料
型号: ISL84782IRZ
厂商: Intersil
文件页数: 4/12页
文件大小: 0K
描述: IC MUX/DEMUX DUAL 4X1 16TQFN
标准包装: 100
功能: 多路复用器/多路分解器
电路: 2 x 4:1
导通状态电阻: 750 毫欧
电压电源: 单电源
电压 - 电源,单路/双路(±): 1.6 V ~ 3.6 V
电流 - 电源: 50nA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 16-WFQFN 裸露焊盘
供应商设备封装: 16-QFN-EP(3x3)
包装: 管件
12
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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For information regarding Intersil Corporation and its products, see www.intersil.com
FN6097.3
November 17, 2004
ISL84782
Thin Quad Flat No-Lead Plastic Package (TQFN)
Thin Micro Lead Frame Plastic Package (TMLFP)
)
INDEX
D1/2
D1
D/2
D
E1/2
E/2
E
A
2X
0.15
B
C
0.10
B
A
MC
A
N
SEATING PLANE
N
6
3
2
3
e
1
0.08
FOR ODD TERMINAL/SIDE
FOR EVEN TERMINAL/SIDE
C
SECTION "C-C"
NX b
A1
C
2X
C
0.15
2X
B
0
REF.
(Nd-1)Xe
(Ne-1)Xe
REF.
5
A1
4X P
A
C
4X P
B
2X
A
C
0.15
A2
A3
D2
E2
E2/2
TERMINAL TIP
SIDE VIEW
TOP VIEW
7
BOTTOM VIEW
7
5
C
L
C
L
e
E1
2
NX k
NX b
8
NX L
8
9
AREA
9
4X
0.10 C
/ /
9
(DATUM B)
(DATUM A)
AREA
INDEX
6
AREA
N
9
CORNER
OPTION 4X
L1
L
10
L1
L
10
L16.3x3A
16 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
SYMBOL
MILLIMETERS
NOTES
MIN
NOMINAL
MAX
A
0.70
0.75
0.80
-
A1
-
0.05
-
A2
-
0.80
9
A3
0.20 REF
9
b
0.18
0.23
0.30
5, 8
D
3.00 BSC
-
D1
2.75 BSC
9
D2
1.35
1.50
1.65
7, 8, 10
E
3.00 BSC
-
E1
2.75 BSC
9
E2
1.35
1.50
1.65
7, 8, 10
e
0.50 BSC
-
k0.20
-
L
0.30
0.40
0.50
8
N16
2
Nd
4
3
Ne
4
3
P-
-
0.60
9
θ
--
12
9
Rev. 0 6/04
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ are present when
Anvil singulation method is used and not present for saw
singulation.
10. Compliant to JEDEC MO-220WEED-2 Issue C, except for the E2
and D2 MAX dimension.
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