参数资料
型号: ISL8501IRZ-T
厂商: Intersil
文件页数: 5/19页
文件大小: 0K
描述: IC REG TRPL BUCK/LINEAR 24QFN
标准包装: 6,000
拓扑: 降压(降压)(1),线性(LDO)(2)
功能: 任何功能
输出数: 3
频率 - 开关: 500kHz
电压/电流 - 输出 1: 控制器
电压/电流 - 输出 2: 0.6 V ~ 4.2 V,500mA
电压/电流 - 输出 3: 0.6 V ~ 4.2 V,500mA
带 LED 驱动器:
带监控器:
带序列发生器:
电源电压: 6 V ~ 25 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-VFQFN 裸露焊盘
供应商设备封装: 24-QFN(4x4)
包装: 带卷 (TR)
ISL8501
Absolute Maximum Ratings (Note 1)
Thermal Information
VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +26V
Thermal Resistance
θ JA (°C/W)
θ JC (°C/W)
VIN_LDOx to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
BOOT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +33V
PHASE to BOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -6V to +0.3V
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
VOUT, LDO1, LDO2 to GND . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
FB_PWM, FB_LDOx to GND. . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
PG_PWM, PG_LDOx to GND . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
EN, EN_LDOx to GND. . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
QFN Package (Notes 1, 2). . . . . . . . . . 36 5
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Junction Temperature Range. . . . . . . . . . . . . . . . . .-55°C to +150°C
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Operating Temperature Range . . . . . . . . . . . . . . . . .-40°C to +85°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CC1, CC2 to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
VCC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
*An accidental short between VCC and GND may cause excessive heating and permanent damage to the device.
NOTES:
1. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379 for details.
2. For θ JC , the “case temp” location is the center of the exposed metal pad on the package underside. See Tech Brief TB379 for details.
Electrical Specifications
Unless Otherwise Noted, All Parameter Limits are Guaranteed Over the Recommended Operating Conditions
and the Typical Specifications are Measured at the Following Conditions: T A = -40°C To +85°C (Note 7),
V IN = 6V to 25V, Unless Otherwise Noted. Typical Values are at T A = +25°C.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
SUPPLY VOLTAGE
VIN Voltage Range
VIN
6
25
V
VIN connected to VCC
4.5
5.0
5.5
V
VIN_LDOx Voltage Range
(Note 6)
1.8
4.6
V
VIN Operating Supply Current
VIN Shutdown Supply Current
I OP
I SD
(Note 3)
EN = EN_LDOx = GND
2.5
70
3.5
100
mA
μ A
POWER-ON RESET
VCC POR Threshold
Rising Edge
4.25
4.40
4.50
V
Hysteresis
260
mV
VIN_LDOx POR Threshold
Rising Edge
Hysteresis
1.2
200
V
mV
INTERNAL VCC LDO
VCC Output Voltage Range
VIN = 6V to 25V, I VCC = 0mA to 50mA
4.5
5.00
5.5
V
REFERENCE
Reference Voltage
V FB
VIN = 6V to 25V, I REF = 0
0.590
0.6
0.609
V
STANDARD BUCK PWM REGULATOR
FB_PWM Line Regulation
IOUT = 0mA, VIN = 6V to 25V
-0.5
0.5
%
FB_PWM Leakage Current
VFB = 0.6V
0
50
100
nA
OSCILLATOR AND PWM MODULATOR
Nominal Switching Frequency
Modulator Gain
Peak-to-Peak Sawtooth Amplitude
PWM Ramp Offset Voltage
Maximum Duty Cycle
f SW
A MOD
V RAMP
V OFFSET
DC MAX
T A = -40°C to +85°C, VCC = 5V
VIN = 12V (AMOD = 10/VIN)
VIN = 12V (VPP = VIN/10)
COMP >4V
450
0.73
0.70
80
500
0.86
1.2
0.8
83
550
0.99
0.91
kHz
V/V
V
V
%
ERROR AMPLIFIER
Open-Loop Gain
88
dB
Gain Bandwidth Product
GBWP
15
MHz
Slew Rate
SR
COMP = 10pF
5
V/ μ s
5
FN6500.1
July 12, 2007
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