参数资料
型号: ISL9003AIRURZ-T
厂商: Intersil
文件页数: 12/12页
文件大小: 0K
描述: IC REG LDO 2.6V .15A 6-TDFN
标准包装: 3,000
稳压器拓扑结构: 正,固定式
输出电压: 2.6V
输入电压: 最高 6.5V
电压 - 压降(标准): 0.25V @ 300mA
稳压器数量: 1
电流 - 输出: 150mA(最小)
电流 - 限制(最小): 175mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-UFDFN 裸露焊盘
供应商设备封装: 6-UTDFN(1.6x1.6)
包装: 带卷 (TR)
ISL9003A
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
6
E
4
A
B
A
L6.1.6x1.6A
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
PIN 1
REFERENCE
D
SYMBOL
A
MIN
0.45
NOMINAL
0.50
MAX
0.55
NOTES
-
2X
0.15 C
1
3
A1
-
-
0.05
-
2X
0.15 C
A3
0.127 REF
-
TOP VIEW
1.00 REF
4
e
6
L
A1
b
D
D2
E
0.15
1.55
0.40
1.55
0.20
1.60
0.45
1.60
0.25
1.65
0.50
1.65
-
4
-
4
D2
CO.2
E2
0.95
1.00
1.05
-
DAP SIZE 1.30 x 0.76
e
0.50 BSC
-
3
1
b 6X
L
0.25
0.30
0.35
-
E2
BOTTOM VIEW
0.10 M C A B
NOTES:
1. Dimensions are in mm. Angles in degrees.
Rev. 1 6/06
0.10 C
DETAIL A
2. Coplanarity applies to the exposed pad as well as the terminals.
Coplanarity shall not exceed 0.08mm.
3. Warpage shall not exceed 0.10mm.
6X
0.08 C
4. Package length/package width are considered as special
characteristics.
SIDE VIEW
A3
C
SEATING
PLANE
5. JEDEC Reference MO-229.
6. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
0.127±0.008
0.127 +0.058
-0.008
TERMINAL THICKNESS
A1
DETAIL A
0.25
0.50
1.00
0.45
1.00
0.30
1.25
LAND PATTERN
6
2.00
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
12
FN6299.4
October 1, 2009
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