参数资料
| 型号： | ISL9109IRZ-T |
| 厂商： | Intersil |
| 文件页数： | 3/13页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 1.5A 8DFN |
| 标准包装： | 6,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.8 V ~ 5.5 V |
| 输入电压： | 2.7 V ~ 5.5 V |
| PWM 型： | 电流模式 |
| 频率 - 开关： | 1.6MHz |
| 电流 - 输出： | 1.5A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-VFDFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 8-DFN（2x3） |
ISL9109
Electrical Specifications
Unless otherwise noted, all parameter limits are guaranteed over the recommended operating conditions and
the typical specifications are measured at the following conditions: T A = +25°C, V IN = V EN = 3.6V, L = 2.2μH,
C 1 = 10μF, C 2 = 10μF, I OUT = 0A (see the“Typical Applications” on page 7). (Continued)
PARAMETER
Soft Start-Up Time
SYMBOL
t SS
TEST CONDITIONS
STBY = 0, EN = _/ˉ
MIN
-
TYP
1.1
MAX
-
UNITS
ms
Start-Up is considered complete when V OUT
reaches 93% of final target voltage.
STBY = 1 for ≥ 1mS, EN = _/ˉ
-
-
60
μs
Start-up is considered complete when V OUT
reaches 93% of final target voltage.
STBY, EN, MODE
Logic Input Low
Logic Input High
-
1.4
-
-
0.4
-
V
V
Logic Input Leakage Current
Pulled up to 5.5V
-
0.1
1
μA
THERMAL SHUTDOWN
Thermal Shutdown
Thermal Shutdown Hysteresis
-
-
160
25
-
-
°C
°C
Pin Descriptions
PIN
PIN #
1
2
3
4
5
6
7
8
E-PAD
NAME
VIN
EN
N/C
MODE
STBY
FB
GND
SW
-
DESCRIPTION
Input supply voltage. Connect a 10μF ceramic capacitor to power ground.
Enable pin. Enable the output when driven to high. Shut down the chip and discharge output capacitor when driven to low. Do
not leave this pin floating
Do not connect; leave floating for proper device operation
Mode selection pin. Connect to logic high or VIN to enable skip mode; connect to logic low or ground for force PWM mode.
Active high enables the band-gap reference.
Buck regulator output feedback pin. Connect to the output voltage through voltage divider resistors for adjustable output
voltage.
System ground.
Switching node connection. Connect to one terminal of the inductor.
Exposed pad. It should be connected to ground for proper electrical performance. For best thermal performance, connect as
much copper as possible to this pad, either on the component layer or other layers through thermal vias.
Typical Operating Performance
100
90
80
70
60
VIN = 3.8V
VIN = 4.2V
VIN = 5.5V
100
90
80
70
60
V I N = 3.0V
VIN = 4.2V
VIN = 5.5V
50
0
250
500
750
1000
1250
1500
50
0
250
500
750
1000
1250
1500
LOAD CURRENT (mA)
FIGURE 1. EFFICIENY vs LOAD CURRENT (V OUT = 3.3V)
3
LOAD CURRENT (mA)
FIGURE 2. EFFICIENCY vs LOAD CURRENT (V OUT = 2.5V)
FN6681.1
September 29, 2008
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