参数资料
型号: ISL97650ARTZ-TK
厂商: Intersil
文件页数: 8/20页
文件大小: 0K
描述: IC LCD SUPPLY HP 4CHAN 36-TQFN
标准包装: 1
应用: LCD 电视机/监控器
电流 - 电源: 250µA
电源电压: 4 V ~ 14 V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 36-WFQFN 裸露焊盘
供应商设备封装: 36-TQFN 裸露焊盘(6x6)
包装: 标准包装
产品目录页面: 1249 (CN2011-ZH PDF)
其它名称: ISL97650ARTZ-TKDKR
ISL97650
Pin Descriptions
PIN NUMBER
1
2
3
4
5, 18
6
7
8
9
10
11
12
13
14
15
16
17
19
20
21
22
23
24
25, 26
27
28
29
30
31
32
33
34
35
36
Exposed Die Plate
PIN NAME
LX1
LX2
CB
LXL
NC
VSUP
FBL
CM2
CTL
AGND2
DRN
COM
POUT
C1-
C1+
C2-
C2+
FBP
VREF
FBN
PGND3
NOUT
VINL
PGND2, 1
AGND1
VDC1
CDEL
ENL
DELB
CM1
VIN
FBB
EN
VDC2
N/A
8
DESCRIPTION
Internal boost switch connection
Internal boost switch connection
Logic buck, boost strap pin
Buck converter output
No connect. Connect to die pad and GND for improved thermal efficiency.
Positive supply for charge pumps
Logic buck feedback pin
Buck compensation network pin
Input control for V ON slice output
Signal GND pin
Lower reference voltage for V ON slice output
V ON slice output: when CTL = 1, COM is connected to SRC through a 5 Ω resistor; when CTL = 0, COM
is connected to DRN through a 30 Ω resistor
Positive charge pump out
Charge pump capacitor 1, negative connection
Charge pump capacitor 1, positive connection
Charge pump capacitor 2, negative connection
Charge pump capacitor 2, positive connection
Positive charge pump feedback pin
Reference voltage
Negative charge pump feedback pin
Power ground for V OFF , V ON and V ON slice
Negative charge pump output
Logic buck supply voltage
Boost power grounds
Signal ground pin
Internal supply decoupling capacitor
Delay capacitor for start up sequencing, soft-start and fault detection timers
Buck enable for V LOGIC output
Open drain NFET output to drive optional A VDD delay PFET
Boost compensation network pin
Input voltage pin
Boost feedback pin
Enable for boost, charge pumps and V ON slice (independent of ENL)
Internal supply decoupling capacitor
Connect exposed die plate on rear of package to ACGND and the PGND1, 2 pins. See the section on
"“Layout Recommendation” on page 19" for PCB layout thermal considerations.
FN9198.4
April 17, 2009
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