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| 型号： | JMK316BJ335KD-T |
| 厂商： | Taiyo Yuden |
| 文件页数： | 27/28页 |
| 文件大小： | 0K |
| 描述： | CAP CER 3.3UF 6.3V 10% X5R 1206 |
| 产品变化通告： | X5R, X7R Part Number Change |
| 标准包装： | 4,000 |
| 系列： | M |
| 电容： | 3.3µF |
| 电压 - 额定： | 6.3V |
| 容差： | ±10% |
| 温度系数： | X5R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 85°C |
| 应用： | 通用 |
| 封装/外壳： | 1206（3216 公制） |
| 尺寸/尺寸： | 0.126" L x 0.063" W（3.20mm x 1.60mm） |
| 厚度（最大）： | 0.037"（0.95mm） |
| 包装： | 带卷 (TR) |
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◆Soldering
? Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.
? Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal
shock.
? Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within
100 to 130℃.
? Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.
［Reflow soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
300
Preheating
60sec. 60sec
230℃
Within 10sec.
300
Peak
260℃ Max.
Within 10sec.
200
Min.
Min.
Slow cooling
200
Slow
cooling
100
100
Preheating150℃ Heating above
60sec. Min.
230℃
0
0
40sec. Max.
Caution
①The ideal condition is to have solder mass （fillet ）controlled to 1/2 to 1/3 of the
thickness of a capacitor.
②Because excessive dwell times can adversely affect solderability, soldering duration shall
be kept as close to recommended times as possible.
［Wave soldering］
【Recommended conditions for eutectic
【Recommended condition for Pb-free
soldering】
soldering】
Solder
Capacitor
PC board
1/2T～1/3T
T
300
200
Preheating
120sec. Min.
230～250℃
Within 3sec.
300
200
120sec. Min.
Peak
260℃ Max.
Within 10sec.
Slow cooling
Preheating
Slow
cooling
100
0
100
0
150℃
Caution
①Wave soldering must not be applied to capacitors designated as for reflow soldering only.
［Hand soldering］
【Recommended conditions for eutectic
soldering】
【Recommended condition for Pb-free
soldering】
400
300
230～280℃
Within 3sec.
400
300
Peak
350℃ Max.
Within 3sec.
400
300
Peak
280℃ Max.
Within 3sec.
⊿T
200
200
Slow cooling
200
⊿T
Slow cooling
100
Slow cooling
100
Preheating
150℃ Min.
100
Preheating
150℃ Min.
Preheating
0
60sec. Min.
0
60sec. Min.
0
60sec. Min.
⊿T
⊿T
316type or less
⊿T≦150℃
325type or more
⊿T≦130℃
Caution
①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.
②The soldering iron shall not directly touch capacitors.
5. Cleaning
◆Cleaning conditions
1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use
Precautions
Technical
considerations
of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect
capacitor's characteristics.
1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate
their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.
2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the
cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall
be carefully checked;
Ultrasonic output : 20 W/? or less
Ultrasonic frequency : 40 kHz or less
Ultrasonic washing period : 5 min. or less
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
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相关代理商/技术参数 |
参数描述 |
|---|---|
| JMK316BJ335MD-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 1206 6.3V X5R 3.3uF 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| JMK316BJ475KD-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 1206 6.3V X5R 4.7uF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| JMK316BJ475MD-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 1206 6.3V X5R 4.7uF 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| JMK316BJ476MD-T | 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MLCC 1206 6.3V X5R 47uF 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| JMK316BJ476MLHT | 制造商:TAIYO YUDEN 功能描述:CAP 47UF 6.3VDC X5R 20% SMD 1206 - Tape and Reel |
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