参数资料
型号: KIT33975AEWEVBE
厂商: Freescale Semiconductor
文件页数: 28/32页
文件大小: 0K
描述: KIT EVALUATION FOR MC33975
标准包装: 1
主要目的: 接口,开关探测
嵌入式:
已用 IC / 零件: MC33975
主要属性: 8 可编程输入(电池开关或接地开关)
次要属性: 14 开关至接地输入
已供物品: 板,CD
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33975
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these limits may cause malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
VDD Supply Voltage
-0.3 to 7.0
VDC
CS, SI, SO, SCLK, INT, AMUX
-0.3 to 7.0
VDC
WAKE
-0.3 to 40
VDC
VPWR Supply Voltage
-0.3 to 50
VDC
VPWR Supply Voltage at -40
C
-0.3 to 45
VDC
Switch Input Voltage Range
33975
33975A
-14 to 38
-14 to 40
VDC
Frequency of SPI Operation (VDD = 5.0 V)
6.0
MHz
ESD Voltage(1)
Human Body Model(2)
Applies to all non-input Pins
Machine Model
Charge Device Model
Corner Pins
Interior Pins
VESD
±2000
±200
750
500
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
TA
TJ
TC
-40 to 125
-40 to 150
-40 to 125
C
Storage Temperature
TSTG
-55 to 150
C
Power Dissipation(3)
PD
1.7
W
Notes
1.
ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), the Machine Model (CZAP =
200 pF, RZAP = 0 ), and the Charge Device Model.
2.
All Programmable Switches (SP) and Switch-to-Ground (SG) input pins when tested individually.
3.
Maximum power dissipation at TJ =150 C junction temperature with no heatsink used.
4.
Thermal resistance between the die and the exposed die pad.
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