参数资料
型号: KMC8113TMP4800V
厂商: Freescale Semiconductor
文件页数: 37/44页
文件大小: 0K
描述: IC DSP 300/400MHZ 431FCPGA
标准包装: 2
系列: StarCore
类型: SC140 内核
接口: 以太网,I²C,TDM,UART
时钟速率: 400MHz
非易失内存: 外部
芯片上RAM: 1.436MB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.10V
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 431-BFBGA,FCBGA
供应商设备封装: 431-FCPBGA(20x20)
包装: 托盘
MSC8113 Tri-Core Digital Signal Processor Data Sheet, Rev. 1
Package Information
Freescale Semiconductor
42
5
Package Information
6
Product Documentation
MSC8113 Technical Data Sheet (MSC8113). Details the signals, AC/DC characteristics, clock signal characteristics,
package and pinout, and electrical design considerations of the MSC8113 device.
MSC8113 Reference Manual (MSC8113RM). Includes functional descriptions of the extended cores and all the
internal subsystems including configuration and programming information.
Application Notes. Cover various programming topics related to the StarCore DSP core and the MSC8113 device.
SC140 DSP Core Reference Manual. Covers the SC140 core architecture, control registers, clock registers, program
control, and instruction set.
Figure 35. MSC8113 Mechanical Information, 431-pin FC-PBGA Package
Notes:
1. All dimensions in millimeters.
2. Dimensioning and tolerancing
per ASME Y14.5M–1994.
3. Features are symmetrical about
the package center lines unless
dimensioned otherwise.
4. Maximum solder ball diameter
measured parallel to Datum A.
5. Datum A, the seating plane, is
determined by the spherical
crowns of the solder balls.
6. Parallelism measurement shall
exclude any effect of mark on
top surface of package.
7. Capacitors may not be present
on all devices.
8. Caution must be taken not to
short capacitors or exposed
metal capacitor pads on
package top.
9. FC CBGA (Ceramic) package
code: 5238.
FC PBGA (Plastic) package
code: 5263.
10.Pin 1 indicator can be in the
form of number 1 marking or an
“L” shape marking.
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KMC8113TVT4800V 功能描述:IC DSP 300/400MHZ 431FCPGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:StarCore 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C,McASP,McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA,FCBGA 供应商设备封装:548-FCBGA(27x27) 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
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