参数资料
型号: KMPC8241LVR266D
厂商: Freescale Semiconductor
文件页数: 42/58页
文件大小: 0K
描述: IC MPU 32BIT 266MHZ 357-PBGA
标准包装: 2
系列: MPC82xx
处理器类型: 32-位 MPC82xx PowerQUICC II
速度: 266MHz
电压: 1.8V
安装类型: 表面贴装
封装/外壳: 357-BBGA
供应商设备封装: 357-PBGA(25x25)
包装: 托盘
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
47
System Design Information
7.7
Thermal Management
This section provides thermal management information for the plastic ball grid array (PBGA) package for
air-cooled applications. Depending on the application environment and the operating frequency, a heat
sink may be required to maintain junction temperature within specifications. Proper thermal control design
primarily depends on the system-level design: heat sink, airflow, and thermal interface material. To reduce
the die-junction temperature, heat sinks can be attached to the package by several methods: adhesive,
spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly (see
Figure 28. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 29 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the PBGA package and a high board-level thermal loading from
adjacent components exists (label used—1s).
A heat sink is not attached to the PBGA package and a low board-level thermal loading from
adjacent components exists (label used—2s2p).
A large heat sink (cross cut extrusion, 38
× 38 × 16.5 mm) is attached to the PBGA package and a
high board-level thermal loading from adjacent components exists (label used—1s/sink).
A large heat sink (cross cut extrusion, 38
× 38 × 16.5 mm) is attached to the PBGA package and a
low board-level thermal loading from adjacent components exists (label used—2s2p/sink).
Adhesive or
Thermal Interface
Heat Sink
PBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
Wire
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