参数资料
型号: L6226PD
厂商: STMICROELECTRONICS
元件分类: 运动控制电子
英文描述: BRUSHLESS DC MOTOR CONTROLLER, 2.8 A, PDSO36
封装: POWER, SO-36
文件页数: 16/31页
文件大小: 525K
代理商: L6226PD
L6226
Thermal management
Doc ID 9452 Rev 4
23/31
7
Thermal management
In most applications the power dissipation in the IC is the main factor that sets the maximum
current that can be deliver by the device in a safe operating condition. Therefore, it has to be
taken into account very carefully. Besides the available space on the PCB, the right package
should be chosen considering the power dissipation. Heat sinking can be achieved using
copper on the PCB with proper area and thickness. Figure 21, 22 and 23 show the junction-
to-ambient thermal resistance values for the PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5 mm copper
thickness FR4 board with 6cm2 dissipating footprint (copper thickness of 35m), the RthJA is
about 35°C/W. Figure 20 shows mounting methods for this package. Using a multi-layer
board with vias to a ground plane, thermal impedance can be reduced down to 15°C/W.
Figure 20.
Mounting the PowerSO package
Figure 21.
PowerSO36 junction-amb. thermal resistance vs on-board copper area
相关PDF资料
PDF描述
L6226QTR BRUSH DC MOTOR CONTROLLER, QCC32
L6226Q BRUSH DC MOTOR CONTROLLER, 2.8 A, QCC32
L6227N STEPPER MOTOR CONTROLLER, 2.8 A, PDIP24
L6228Q STEPPER MOTOR CONTROLLER, 2.8 A, QCC32
L6228QTR STEPPER MOTOR CONTROLLER, QCC32
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