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参数资料
| 型号： | LD6806CX4/27P,315 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 28/36页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 200MA 2.7V 4WLCSP |
| 标准包装： | 9,000 |
| 系列： | * |
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NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
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?
?
?
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
? Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
? Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 44 ) than a SnPb process, thus
reducing the process window
? Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 16 and 17
Table 16.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature ( ? C)
Volume (mm 3 )
< 350
? 350
< 2.5
? 2.5
Table 17.
235
220
Lead-free process (from J-STD-020C)
220
220
Package thickness (mm)
Package reflow temperature ( ? C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LD6806F | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Ultra low-dropout regulator, low noise, 200 mA |
| LD6806F/12H | 制造商:NXP Semiconductors 功能描述:LDO 1.2V SOT886 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, SOT886 |
| LD6806F/12H,115 | 功能描述:低压差稳压器 - LDO LD6806 ULTRA LOW-DO VOLT REG 200MA RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| LD6806F/12P | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 200MA 6SOT886 |
| LD6806F/12P,115 | 功能描述:低压差稳压器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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