参数资料
型号: LD6806CX4/27P,315
厂商: NXP Semiconductors
文件页数: 29/36页
文件大小: 0K
描述: IC REG LDO 200MA 2.7V 4WLCSP
标准包装: 9,000
系列: *
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 44 .
maximum peak temperature
temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 44. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
16. Mounting
16.1 PCB design guidelines
It is recommended, for optimum performance, to use a Non-Solder Mask Defined
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
Refer to Table 18 for the recommended PCB design parameters.
Table 18.
Parameter
Recommended PCB design parameters
Value or specification
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
250 ? m
100 ? m (0.004 inch)
325 ? m
20 ? m to 40 ? m
AuNi or OSP
FR4
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
29 of 36
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