参数资料
| 型号： | LD6806F/36H,115 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 26/36页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.6V .2A 6XSON |
| 标准包装： | 5,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.6V |
| 输入电压： | 最高 5.5V |
| 电压 - 压降（标准）： | 0.06V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA（最小值） |
| 电流 - 限制（最小）： | 300mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-XFDFN |
| 供应商设备封装： | 6-XSON，SOT886（1.45x1） |
| 包装： | 带卷 (TR) |
| 其它名称： | LD6806F36H115 |
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NXP Semiconductors
temperature
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 43. Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description” .
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
? The amount of printed solder on the substrate
? The size of the solder land on the substrate
? The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
14.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
26 of 36
相关PDF资料 |
PDF描述 |
|---|---|
| LD6806F/33H,115 | IC REG LDO 3.3V .2A 6XSON |
| LD6806F/29H,115 | IC REG LDO 2.9V .2A 6XSON |
| RBC70DCMN-S288 | CONN EDGECARD 140POS .100 EXTEND |
| AGM25DRSH | CONN EDGECARD 50POS DIP .156 SLD |
| AYM25DRSD | CONN EDGECARD 50POS DIP .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LD6806TD | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Ultra low-dropout regulator, low noise, 200 mA |
| LD6806TD/12H | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 200MA 5SOT753 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 200MA, 5SOT753 制造商:NXP Semiconductors 功能描述:LDO with 60mV drop at 200mA, SOT753, 1,2Vout, High ohmic output 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 200MA, 5SOT753, Primary Input Voltage:5.5V, Output Voltage Fixed:1.2V |
| LD6806TD/12H,125 | 功能描述:低压差稳压器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| LD6806TD/12P | 制造商:NXP Semiconductors 功能描述:LDO 1.2V 200MA 5SOT753 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 200MA, 5SOT753 制造商:NXP Semiconductors 功能描述:LDO, 1.2V, 200MA, 5SOT753; Primary Input Voltage:5.5V; Output Voltage Fixed:1.2V; Dropout Voltage Vdo:80mV; Voltage Regulator Case Style:TSOP; No. of Pins:5; Output Current:200mA; Operating Temperature Min:-40C; Operating ;RoHS Compliant: Yes |
| LD6806TD/12P,125 | 功能描述:低压差稳压器 - LDO 2.3-5.5VIN 1.2VOUT RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
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