参数资料
型号: LD6806F/36H,115
厂商: NXP Semiconductors
文件页数: 30/36页
文件大小: 0K
描述: IC REG LDO 3.6V .2A 6XSON
标准包装: 5,000
稳压器拓扑结构: 正,固定式
输出电压: 3.6V
输入电压: 最高 5.5V
电压 - 压降(标准): 0.06V @ 200mA
稳压器数量: 1
电流 - 输出: 200mA(最小值)
电流 - 限制(最小): 300mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 6-XFDFN
供应商设备封装: 6-XSON,SOT886(1.45x1)
包装: 带卷 (TR)
其它名称: LD6806F36H115
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
16.2 PCB assembly guidelines for Pb-free soldering
Table 19.
Parameter
Assembly recommendations
Value or specification
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
Solder reflow profile
T
( ° C)
T reflow(peak)
250
230
217
preheat
250 ? m
100 ? m (0.004 inch)
SnAg (3 % to 4 %); Cu (0.5 % to 0.9 %)
50 : 50
cooling rate
t 1
t 2
t (s)
t 3
t 4
t 5
001aai943
The device is capable of withstanding at least three reflows at this profile.
Fig 45. Pb-free solder reflow profile
Table 20.
Characteristics
Symbol
T reflow(peak)
t 1
t 2
t 3
t 4
t 5
dT/dt
Parameter
peak reflow temperature
time 1
time 2
time 3
time 4
time 5
rate of change of
temperature
Conditions
soak time
time during T ? 250 ? C
time during T ? 230 ? C
time during T > 217 ? C
cooling rate
preheat
Min
230
60
-
10
30
-
-
2.5
Typ
-
-
-
-
-
-
-
-
Max
260
180
30
50
150
540
? 6
4.0
Unit
? C
s
s
s
s
s
? C/s
? C/s
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
30 of 36
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