- 您现在的位置：买卖IC网 > PDF目录17734 > LD6806TD/12P,125 (NXP Semiconductors)IC REG LDO 200MA 1.2V 5TSOP PDF资料下载
参数资料
| 型号： | LD6806TD/12P,125 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 25/36页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 200MA 1.2V 5TSOP |
| 标准包装： | 3,000 |
| 系列： | * |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页当前第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页
NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
? Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 43 ) than a PbSn process, thus
reducing the process window
? Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
? Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 15 .
Table 15.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature ( ? C)
Volume (mm 3 )
< 350
350 to 2000
> 2000
< 1.6
1.6 to 2.5
> 2.5
260
260
250
260
250
245
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 43 .
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
25 of 36
相关PDF资料 |
PDF描述 |
|---|---|
| CPPLC5-LT5PP | OSC 3.3V PROG CMOS PWRDN 50PPM |
| IS-L0102-IS15ABCP4CF | BOARD LOGIC IS15ABCP4CF & AT548 |
| CPPLC5-LT56T | OSC 3.3V PROG CMOS TRI ST 100PPM |
| CPPLC5-LT56P | OSC 3.3V PROG CMOS PWRDN 100PPM |
| CPPLC5-LT0PT | OSC 3.3V PROG CMOS TRI ST 50PPM |
相关代理商/技术参数 |
参数描述 |
|---|---|
| LD6815TD/12H | 制造商:NXP Semiconductors 功能描述:LDO 5.5V 0.25VDO 0.15A 1.2V 5TSOP 制造商:NXP Semiconductors 功能描述:LDO, 5.5V, 0.25VDO, 0.15A, 1.2V, 5TSOP |
| LD6815TD/12H,125 | 功能描述:低压差稳压器 - LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| LD6815TD/12P | 制造商:NXP Semiconductors 功能描述:LDO, 5.5V, 0.25VDO, 0.15A, 1.2V, 5TSOP |
| LD6815TD/12P,125 | 功能描述:低压差稳压器 - LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| LD6815TD/15H | 制造商:NXP Semiconductors 功能描述:LDO 5.5V 0.25VDO 0.15A 1.5 制造商:NXP Semiconductors 功能描述:LDO, 5.5V, 0.25VDO, 0.15A, 1.5V, 5TSOP; Primary Input Voltage:5.5V; Output Voltage Fixed:1.5V; Dropout Voltage Vdo:250mV; Voltage Regulator Case Style:TSOP; No. of Pins:5; Output Current:150mA; Operating Temperature Min:-40C; ;RoHS Compliant: Yes |
发布紧急采购，3分钟左右您将得到回复。