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| 型号： | LD6806TD/12P,125 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 27/36页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 200MA 1.2V 5TSOP |
| 标准包装： | 3,000 |
| 系列： | * |
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NXP Semiconductors
LD6806 series
Ultra low-dropout regulator, low noise, 200 mA
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description” .
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
15. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
? Through-hole components
? Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
? Board specifications, including the board finish, solder masks and vias
? Package footprints, including solder thieves and orientation
LD6806_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 9 December 2011
? NXP B.V. 2011. All rights reserved.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LD6815TD/12H | 制造商:NXP Semiconductors 功能描述:LDO 5.5V 0.25VDO 0.15A 1.2V 5TSOP 制造商:NXP Semiconductors 功能描述:LDO, 5.5V, 0.25VDO, 0.15A, 1.2V, 5TSOP |
| LD6815TD/12H,125 | 功能描述:低压差稳压器 - LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| LD6815TD/12P | 制造商:NXP Semiconductors 功能描述:LDO, 5.5V, 0.25VDO, 0.15A, 1.2V, 5TSOP |
| LD6815TD/12P,125 | 功能描述:低压差稳压器 - LDO RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| LD6815TD/15H | 制造商:NXP Semiconductors 功能描述:LDO 5.5V 0.25VDO 0.15A 1.5 制造商:NXP Semiconductors 功能描述:LDO, 5.5V, 0.25VDO, 0.15A, 1.5V, 5TSOP; Primary Input Voltage:5.5V; Output Voltage Fixed:1.5V; Dropout Voltage Vdo:250mV; Voltage Regulator Case Style:TSOP; No. of Pins:5; Output Current:150mA; Operating Temperature Min:-40C; ;RoHS Compliant: Yes |
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