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参数资料
| 型号： | LG624 DAISY CHAIN-1 |
| 厂商： | Microsemi SoC |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | DAISY CHAIN PKG MECH 624-CLGA |
| 标准包装： | 1 |
| 附件类型： | 菊花链封装 |
| 适用于相关产品： | Microsemi FPGA |
Package Prototyping Solutions
Microsemi has developed multiple low-cost prototyping solutions for RTAX-S/SL devices that ultimately are packaged in CQFP or CCGA for the production
system. These solutions utilize Axcelerator family Fine Pitch Ball Grid Array (FBGA) or Ceramic Land Grid Array (CLGA) packages as prototyping vehicles:
? CQFP to FBGA adapter socket
? CQFP to CLGA adapter socket
? CCGA to FBGA adapter socket
? CCGA to CLGA adapter socket
The CQFP to FBGA adapter sockets have an FBGA configuration on the top and a CQFP configuration on the bottom. The adapter sockets enable customers
to use a commercial Axcelerator FG package during prototyping, and then switch to an equivalent CQ256 or CQ352 package for production.
Adapter Socket
CQ352 to FG484
CQ352 to FG896
CQ352 to FG896
Ordering Part Number
SK-AX250-CQ352RTFG484S
SK-AX1-AX2-KITTOP and
SK-AX1-CQ352-KITBTM
SK-AX1-AX2-KITTOP and
SK-AX2-CQ352-KITBTM
Prototyped and Prototype Device
For prototyping RTAX250S/L-CQ352
or AX250-CQ352 using
AX250-FG484 package
For prototyping RTAX1000S/L-CQ352
or AX1000-CQ352 using
AX1000-FG896 package
For prototyping RTAX2000S/L-CQ352
or AX2000-CQ352 using
AX2000-FG896 package
CQ256 to FG896
CG624 to FG484
CG624 to FG896
CG624 to FG896
SH-AX2-CQ256-KITTOP and
SK-AX2-CQ256-KITBTM
SK-SX72-CG624RTFG484
SK-AX1-AX2-KITTOP and
SK-AX1-CG624-KITBTM
SK-AX1-AX2-KITTOP and
SK-AX2-CG624-KITBTM
For prototyping RTAX2000S/L-CQ352
or AX2000-CQ256 using
AX2000-FG896 package
For prototyping RTSX72SU-CG624
or A54SX72A-CG624 using
A54SX72A-FG484 package
For prototyping RTAX1000S-CG624,
RTAX1000SL-CG624, or AX1000-CG624
using AX1000-FG896 package
For prototyping RTAX2000S-CG624,
RTAX2000SL-CG624, or AX2000-CG624
using AX2000-FG896 package
RTAX2000S CQ256 to FG896 Ceramic Adapter, Top and Bottom
Daisy-Chained Packages
To facilitate the qualification of target FPGA device socket and board assembly practices without using costly flight-quality parts, Microsemi offers certain Ceramic
Column Grid Array (CCGA) and Ceramic Land Grid Array (CLGA) packages with adjacent pairs of pins tied together. By assembling these packages onto a
qualification PC board that is laid out with adjacent pairs of solder pads tied together but offset by one pin as compared to the package, a single signal can be
fed into one pin of the package and routed into and out of the entire package in a serial daisy chain fashion so all pins of the package are used. This is useful for
performing continuity and impedance tests to validate board assembly techniques with surface-mount grid array packages. Microsemi’s daisy chain packages
feature metal routing tracks between adjacent pairs of package pins, internal to the package. For package qualification, an unbonded silicon die is included in
the package.
Microsemi Part Number
LG624 DAISY CHAIN-1
LG1152 DAISY CHAIN
LG1272 DAISY CHAIN
CG484 DAISY CHAIN
Description
624-pin CLGA mechanical package
1152-pin CLGA mechanical package
1272-pin CLGA mechanical package
484-pin CCGA mechanical package
CG624 DAISY CHAIN SIX
CG896 DAISY CHAIN
CG1152 DAISY CHAIN
CG1272 DAISY CHAIN
624-pin CCGA mechanical package
896-pin CCGA mechanical package
1152-pin CCGA mechanical package
1272-pin CCGA mechanical package
Printed Circuit Board
Daisy Chain Start
Partial View of 624 CGA with Adjacent Pin Pairs Tied Together
Package
All Pins are Connected Serially
13
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