参数资料
型号: LM10506TMX-A
厂商: NATIONAL SEMICONDUCTOR CORP
元件分类: 电源管理
英文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PBGA34
封装: 0.40 MM PITCH, MICRO SMD-34
文件页数: 26/34页
文件大小: 1020K
代理商: LM10506TMX-A
30166226
FIGURE 9. Possible PCB Layout Configuration to Use
6X Through Hole Vias in the Middle
Outside 7x7 array 0.4 mm micro SMD 34-bump, with 24
peripheral and 6 inner vias = 30 individual signals
22.1 PCB LAYOUT THERMAL DISSIPATION FOR MICRO SMD PACKAGE
1.
Position ground layer as close as possible to micro SMD
package. Second PCB layer is usually good option.
LM10506 evaluation board is a good example.
2.
Draw power traces as wide as possible. Bumps which
carry high currents should be connected to wide traces.
This helps the silicon to cool down.
www.national.com
32
LM10506
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