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参数资料
| 型号： | LM25066APSQX |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 电源管理 |
| 英文描述： | POWER SUPPLY SUPPORT CKT, QCC24 |
| 封装： | LLP-24 |
| 文件页数： | 39/48页 |
| 文件大小： | 1658K |
| 代理商： | LM25066APSQX |
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SMBus Communications Timing
Requirements
301460a1
FIGURE 19. SMBus Timing Diagram
TABLE 45. SMBus Timing Definition
Symbol
Parameter
Limits
Units
Comments
Min
Max
F
SMB
SMBus Operating Frequency
10
400
kHz
T
BUF
Bus free time between Stop and Start Condition
1.3
s
T
HD:STA
Hold time after (Repeated) Start Condition. After this
period, the first clock is generated.
0.6
s
T
SU:STA
Repeated Start Condition setup time
0.6
s
T
SU:STO
Stop Condition setup time
0.6
s
T
HD:DAT
Data hold time
300
ns
T
SU:DAT
Data setup time
100
ns
T
TIMEOUT
Clock low timeout
25
35
ms
(Note 8)
T
LOW
Clock low period
1.5
s
T
HIGH
Clock high period
0.6
s
(Note 9)
T
LOW:SEXT
Cumulative clock low extend time (slave device)
25
ms
T
LOW:MEXT
Cumulative low extend time (master device)
10
ms
T
F
Clock or Data Fall Time
20
300
ns
T
R
Clock or Data Rise Time
20
300
ns
Note 8:
Devices participating in a transfer will timeout when any clock low exceeds the value of T
TIMEOUT,MIN of 25 ms. Devices that have detected a timeout
condition must reset the communication no later than T
TIMEOUT,MAX of 35 ms. The maximum value must be adhered to by both a master and a slave as it incorporates
the cumulative stretch limit for both a master (10ms) and a slave (25ms).
Note 9:
T
HIGH MAX provides a simple method for devices to detect bus idle conditions.
Note 10:
T
LOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from the initial start to the stop. If a slave exceeds
this time, it is expected to release both its clock and data lines and reset itself.
Note 11:
T
LOW:MEXT is the cumulative time a master device is allowed to extend its clock cycles within each byte of a message as defined from start-to-ack, ack-
to-ack, or ack-to-stop.
Note 12:
Rise and fall time is defined as follows:
T
R = ( VILMAX – 0.15) to (VIHMIN + 0.15)
T
F = 0.9 VDD to (VILMAX – 0.15)
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LM25066A
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LM25066APSQX/NOPB | 功能描述:热插拔功率分布 RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| LM25066EVK/NOPB | 功能描述:电源管理IC开发工具 LM25066 EVAL BOARD RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| LM25066IAPSQ/NOPB | 制造商:Texas Instruments 功能描述:IC PWR MGMT/PROT PMBUS 24WQFN 制造商:Texas Instruments 功能描述:System PWR Mgmt & Protection IC |
| LM25066IAPSQE/NOPB | 功能描述:热插拔功率分布 System PWR Mgmt & Protection IC RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制:45 mA 电源电压-最大:17 V 电源电压-最小:2.9 V 工作温度范围:- 40 C to + 85 C 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:WQFN-24 封装:Reel |
| LM25066IAPSQX/NOPB | 制造商:Texas Instruments 功能描述:IC PWR MGMT/PROT PMBUS 24WQFN 制造商:Texas Instruments 功能描述:System PWR Mgmt & Protection IC |
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