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参数资料
| 型号： | LM2575T-012G |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 稳压器 |
| 英文描述： | 3.2 A SWITCHING REGULATOR, 63 kHz SWITCHING FREQ-MAX, SFM5 |
| 封装： | LEAD FREE, CASE 314D-04, TO-220, 5 PIN |
| 文件页数： | 12/28页 |
| 文件大小： | 492K |
| 代理商： | LM2575T-012G |
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LM2575, NCV2575
http://onsemi.com
2
Figure 1. Block Diagram and Typical Application
7.0 V - 40 V
Unregulated
DC Input
L1
330
mH
GND
+Vin
1
Cin
100
mF
3ON/OFF
5
Output
2
Feedback
4
D1
1N5819
Cout
330
mF
Typical Application (Fixed Output Voltage Versions)
Representative Block Diagram and Typical Application
Unregulated
DC Input
+Vin
1
Cout
Feedback
4
Cin
L1
D1
R2
R1
1.0 k
Output
2
GND
3
ON/OFF
5
Reset
Latch
Thermal
Shutdown
52 kHz
Oscillator
1.235 V
Band-Gap
Reference
Freq
Shift
18 kHz
Comparator
Fixed Gain
Error Amplifier
Current
Limit
Driver
1.0 Amp
Switch
ON/OFF
3.1 V Internal
Regulator
Regulated
Output
Vout
Load
Output
Voltage Versions
3.3 V
5.0 V
12 V
15 V
R2
(
W)
1.7 k
3.1 k
8.84 k
11.3 k
For adjustable version
R1 = open, R2 = 0
W
LM2575
5.0 V Regulated
Output 1.0 A Load
This device contains 162 active transistors.
ABSOLUTE MAXIMUM RATINGS (Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.)
Rating
Symbol
Value
Unit
Maximum Supply Voltage
Vin
45
V
ON/OFF Pin Input Voltage
0.3 V ≤ V ≤ +Vin
V
Output Voltage to Ground (SteadyState)
1.0
V
Power Dissipation
Case 314B and 314D (TO220, 5Lead)
PD
Internally Limited
W
Thermal Resistance, JunctiontoAmbient
RqJA
65
°C/W
Thermal Resistance, JunctiontoCase
RqJC
5.0
°C/W
Case 936A (D2PAK)
PD
Internally Limited
W
Thermal Resistance, JunctiontoAmbient (Figure 34)
RqJA
70
°C/W
Thermal Resistance, JunctiontoCase
RqJC
5.0
°C/W
Storage Temperature Range
Tstg
65 to +150
°C
Minimum ESD Rating (Human Body Model: C = 100 pF, R = 1.5 kW)
2.0
kV
Lead Temperature (Soldering, 10 s)
260
°C
Maximum Junction Temperature
TJ
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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