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参数资料
| 型号： | LM2596TVADJG |
| 厂商： | ON Semiconductor |
| 文件页数： | 17/25页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK ADJ 3A TO220-5 |
| 标准包装： | 50 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 1.23 V ~ 37 V |
| 输入电压： | 4.5 V ~ 40 V |
| PWM 型： | 电压模式 |
| 频率 - 开关： | 150kHz |
| 电流 - 输出： | 3A |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-220-5 成形引线 |
| 包装： | 管件 |
| 供应商设备封装： | TO-220-5 |
| 其它名称： | LM2596TVADJG-ND LM2596TVADJGOS |
LM2596
heat dissipation significantly. If further thermal
improvements are needed, double sided or multilayer PC
boards with large copper areas should be considered. In
order to achieve the best thermal performance, it is highly
recommended to use wide copper traces as well as large
areas of copper in the printed circuit board layout. The only
exception to this is the OUTPUT (switch) pin, which should
Thermal Analysis and Design
The following procedure must be performed to determine
whether or not a heatsink will be required. First determine:
1. P D(max) maximum regulator power dissipation in the
application.
2. T A(max ) maximum ambient temperature in the
application.
3. T J(max) maximum allowed junction temperature
(125 ° C for the LM2596). For a conservative
design, the maximum junction temperature
should not exceed 110 ° C to assure safe
operation. For every additional +10 ° C
temperature rise that the junction must
withstand, the estimated operating lifetime
of the component is halved.
4. R q JC package thermal resistance junction ? case.
5. R q JA package thermal resistance junction ? ambient.
The following formula is to calculate the approximate
total power dissipated by the LM2596:
P D = (V in x I Q ) + d x I Load x V sat
where d is the duty cycle and for buck converter
V O is the regulator output voltage,
I Load is the load current.
The dynamic switching losses during turn ? on and
turn ? off can be neglected if proper type catch diode is used.
Packages Not on a Heatsink (Free ? Standing)
For a free ? standing application when no heatsink is used,
the junction temperature can be determined by the following
expression:
T J = (R q JA ) (P D ) + T A
where (R q JA )(P D ) represents the junction temperature rise
caused by the dissipated power and T A is the maximum
ambient temperature.
Packages on a Heatsink
If the actual operating junction temperature is greater than
the selected safe operating junction temperature determined
in step 3, than a heatsink is required. The junction
temperature will be calculated as follows:
T J = P D (R q JA + R q CS + R q SA ) + T A
where R q JC is the thermal resistance junction ? case,
R q CS is the thermal resistance case ? heatsink,
R q SA is the thermal resistance heatsink ? ambient.
If the actual operating temperature is greater than the
selected safe operating junction temperature, then a larger
heatsink is required.
Some Aspects That can Influence Thermal Design
It should be noted that the package thermal resistance and
the junction temperature rise numbers are all approximate,
and there are many factors that will affect these numbers,
such as PC board size, shape, thickness, physical position,
location, board temperature, as well as whether the
surrounding air is moving or still.
d + on + O ,
V in
I Q
V in
t V
T
(quiescent current) and V sat can be found in the
LM2596 data sheet,
is minimum input voltage applied,
Other factors are trace width, total printed circuit copper
area, copper thickness, single ? or double ? sided, multilayer
board, the amount of solder on the board or even color of the
traces.
The size, quantity and spacing of other components on the
board can also influence its effectiveness to dissipate the heat.
12 to 40 V
Feedback
R4
Unregulated
DC Input
+V in
LM2596 ? ADJ
L1
33 m H
C in
100 m F/50 V
ON/OFF
GND
D1
1N5822
C out
220 m F
R3
? 12 V @ 0.7 A
Regulated
Output
Figure 22. Inverting Buck ? Boost Develops ? 12 V
http://onsemi.com
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