
Electrical Characteristics (Continued)
V
CC = +15V unless otherwise indicated under the Conditions column. Typicals and limits appearing in plain type apply for TA
=T
J = +25C. Limits appearing in boldface type apply over 40C to +125C.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Error Amplifier
I
fb2
Feedback Input Bias
Current, Channel 2
V
FB2 = 1.36V
18
nA
I
fb3
Feedback Input Bias
Current, Channel 3
V
FB3 = 1.36V
70
nA
I
comp1,
I
comp2
COMP Output Sink
Current
V
FB1 = 150% of measured 1.4V DAC,
V
FB2 = 150% of measured bandgap,
V
COMP1 =VCOMP2 =1V
91
A
V
comp_max
COMP Pin Maximum
Voltage
tbd
1.96
V
Gm
Transconductance
576
mho
DAC Output and V
FB2
V
dac
Channel 1 DAC Output
Voltage Accuracy
VCOMP1 = 1V, DAC codes from 1.3V
to 1.6V
2.0
%
VCOMP1 = 1V, DAC codes from
0.925V to 1.25V and from 1.65V to
2.00V
2.2
V
fb2
Channel 2 DC Output
Voltage Accuracy
COMP2 pin from 0.5V to 1.8V
1.212
1.238
1.264
V
Linear Regulator Controller
V
fb3
Channel 3 DC Output
Voltage Accuracy
1.209
1.24
1.271
V
g3_sk
G3 Sink Current
20
A
I
g3_sc
G3 Minimum Source
Current
20
mA
V
g3_max
G3 Maximum Voltage
3.6
V
Logic Inputs and Outputs
V
ih
Minimum High Level
Input Voltage (FPWM,
VID0-VID4)
2.2
V
il
Maximum Low Level
Input Voltage (FPWM,
ON/SS1, ON/SS2,
VID0-VID4)
0.7
V
I
oh_pg
PGOOD Output High
Current
5A
V
ol_pg
PGOOD Output Low
Voltage
PGOOD Sinking 20 A
0.3
V
Note 11: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics table.
Note 12: Maximum allowable power dissipation is calculated by using PDMAX =(TJMAX -TA)/θJA, where TJMAX is the maximum junction temperature, TA is the
ambient temperature and
θJA is the junction-to-ambient thermal resistance of the specified package. The 1.56W rating results from using 150C, 25C, and 80C/W
for TJMAX,TA, and θJA respectively. A θJA of 90C/W represents the worst-case condition of no heat sinking of the 48-pin TSSOP. Heat sinking allows the safe
dissipation of more power. The Absolute Maximum power dissipation should be derated by 12.5mW per C above 25C ambient. The LM2633 actively limits its
junction temperature to about 150C.
Note 13: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation.
Note 14: Except for ILIM1 and ILIM2 pins, which are 1.5kV. For testing purposes, ESD was applied using the human-body model, a 100pF capacitor discharged
through a 1.5k
resistor.
Note 15: A typical is the center of characterization data taken with TA =TJ = 25C. Typical data are not guaranteed.
Note 16: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TA =TJ = 25C. All hot and cold
limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
Note 17: This test simulates heavy load condition by changing COMP pin voltage.
Note 18: This parameter indicates how much current the LM2633 is drawing from the input supply when it is functioning but not driving external MOSFETs or a
bipoloar transistor.
LM2633
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