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| 型号： | LM2735XMFEVAL |
| 厂商： | National Semiconductor |
| 文件页数： | 17/58页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO FOR LM2735 SOT23-5 |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步升 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 12V |
| 电流 - 输出： | 500mA |
| 输入电压： | 3 ~ 5.5 V |
| 稳压器拓扑结构： | 升压 |
| 频率 - 开关： | 1.6MHz |
| 板类型： | 完全填充 |
| 已供物品： | 板，文档 |
| 已用 IC / 零件： | LM2735 |
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SNVS485F – JUNE 2007 – REVISED APRIL 2013
Definitions
Heat energy is transferred from regions of high temperature to regions of low temperature via three basic
mechanisms: radiation, conduction and convection.
Radiation Electromagnetic transfer of heat between masses at different temperatures.
Conduction Transfer of heat through a solid medium.
Convection Transfer of heat through the medium of a fluid; typically air.
Conduction & Convection will be the dominant heat transfer mechanism in most applications.
R θ JC Thermal impedance from silicon junction to device case temperature.
R θ JA Thermal impedance from silicon junction to ambient air temperature.
C θ JC Thermal Delay from silicon junction to device case temperature.
C θ CA Thermal Delay from device case to ambient air temperature.
R θ JA & R θ JC These two symbols represent thermal impedances, and most data sheets contain associated values
for these two symbols. The units of measurement are °C/Watt.
R θ JA is the sum of smaller thermal impedances (see Figure 27 ). The capacitors represent delays that are present
from the time that power and its associated heat is increased or decreased from steady state in one medium until
the time that the heat increase or decrease reaches steady state on the another medium.
R T C - A
C T C - A
T C
R T J- CASE
C T J- CASE
T A
T J
Internal - P DISS
Figure 27. Simplified Thermal Impedance Model
The datasheet values for these symbols are given so that one might compare the thermal performance of one
package against another. In order to achieve a comparison between packages, all other variables must be held
constant in the comparison (PCB size, copper weight, thermal vias, power dissipation, V IN , V OUT , Load Current
etc). This does shed light on the package performance, but it would be a mistake to use these values to calculate
the actual junction temperature in your application.
R T JA =
T J - T A
P Dissipatio n
(17)
We will talk more about calculating the variables of this equation later, and how to eventually calculate a proper
junction temperature with relative certainty. For now we need to define the process of calculating the junction
temperature and clarify some common misconceptions.
R θ JA [Variables]:
?
?
?
?
Input Voltage, Output Voltage, Output Current, RDSon.
Ambient temperature & air flow.
Internal & External components power dissipation.
Package thermal limitations.
Copyright ? 2007–2013, Texas Instruments Incorporated
Product Folder Links: LM2735
17
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LM2735XMFEVAL/NOPB | 功能描述:电源管理IC开发工具 LM2735XMF EVAL BOARD RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
| LM2735XMFX | 制造商:NSC 制造商全称:National Semiconductor 功能描述:520kHz/1.6MHz - Space-Efficient Boost and SEPIC DC-DC Regulator |
| LM2735XMFX/NOPB | 功能描述:直流/直流开关调节器 RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
| LM2735XMY | 制造商:Texas Instruments 功能描述:Conv DC-DC Single Step Up 2.7V to 5.5V 8-Pin MSOP EP T/R 制造商:Texas Instruments 功能描述:SWITCH REG, BOOST, 1.6MHZ, MSOP8 |
| LM2735XMY/NOPB | 功能描述:直流/直流开关调节器 RoHS:否 制造商:International Rectifier 最大输入电压:21 V 开关频率:1.5 MHz 输出电压:0.5 V to 0.86 V 输出电流:4 A 输出端数量: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:PQFN 4 x 5 |
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