参数资料
型号: LM3102TL-1/NOPB
厂商: National Semiconductor
文件页数: 17/24页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 2.5A 28USMD
标准包装: 1
系列: PowerWise®, SIMPLE SWITCHER®
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.8 V ~ 7 V
输入电压: 4.5 V ~ 42 V
PWM 型: 电流模式
频率 - 开关: 1MHz
电流 - 输出: 2.5A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 28-WFBGA
包装: 标准包装
供应商设备封装: 28-uSMD
其它名称: LM3102TL-1/NOPBDKR
SNVS515G – SEPTEMBER 2007 – REVISED JANUARY 2012
PC BOARD LAYOUT
The LM3102 regulation, over-voltage, and current limit comparators are very fast so they will respond to short
duration noise pulses. Layout is therefore critical for optimum performance. It must be as neat and compact as
possible, and all external components must be as close to their associated pins of the LM3102 as possible. Refer
to the functional block diagram, the loop formed by C IN , the main and synchronous MOSFET internal to the
LM3102, and the PGND pin should be as small as possible. The connection from the PGND pin to C IN should be
as short and direct as possible. Vias should be added to connect the ground of C IN to a ground plane, located as
close to the capacitor as possible. The bootstrap capacitor C BST should be connected as close to the SW and
BST pins as possible, and the connecting traces should be thick. The feedback resistors and capacitor R FB1 ,
R FB2 , and C FB should be close to the FB pin. A long trace running from V OUT to R FB1 is generally acceptable
since this is a low impedance node. Ground R FB2 directly to the AGND pin (pin 7). The output capacitor C OUT
should be connected close to the load and tied directly to the ground plane. The inductor L should be connected
close to the SW pin with as short a trace as possible to reduce the potential for EMI (electromagnetic
interference) generation. If it is expected that the internal dissipation of the LM3102 will produce excessive
junction temperature during normal operation, making good use of the PC board’s ground plane can help
considerably to dissipate heat. The exposed pad on the bottom of the LM3102 IC package can be soldered to
the ground plane, which should extend out from beneath the LM3102 to help dissipate heat. The exposed pad is
internally connected to the LM3102 IC substrate. Additionally the use of thick traces, where possible, can help
conduct heat away from the LM3102. Using numerous vias to connect the die attached pad to the ground plane
is a good practice. Judicious positioning of the PC board within the end product, along with the use of any
available air flow (forced or natural convection) can help reduce the junction temperature.
Figure 30. Typical Application Schematic for V OUT = 3.3V
Figure 31. Typical Application Schematic for V OUT = 0.8V
Copyright ? 2007–2012, Texas Instruments Incorporated
Product Folder Links: LM3102
17
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