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参数资料
| 型号： | LM3370TLX-2613/NOPB |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 稳压器 |
| 英文描述： | 1.4 A DUAL SWITCHING CONTROLLER, 2400 kHz SWITCHING FREQ-MAX, PBGA20 |
| 封装： | 3 X 2 MM, 0.60 MM HEIGHT, 0.50 MM PITCH, , MO-211DG, MICRO, SMD-20 |
| 文件页数： | 24/26页 |
| 文件大小： | 5436K |
| 代理商： | LM3370TLX-2613/NOPB |
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
Internal thermal shutdown circuitry protects the device from permanent damage. The thermal shutdown engages at T
J = 150°C (typ.) and disengages
at T
J = 140°C(typ.).
Note 4:
For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1187: Leadless Leadframe Package (LLP)
(AN-1187).
Note 5:
The Human body model is a 100 pF capacitor discharged through a 1.5 k
resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200
pF capacitor discharged directly into each pin. (EAIJ)
Note 6:
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-
rated. Maximum ambient temperature (T
A-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125C), the maximum power dissipation
of the device in the application (P
D-MAX), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following
equation: T
A-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Note 7:
Junction-to-ambient thermal resistance (
θ
JA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the
JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1 array of thermal vias. Thickness of copper
layers are 2/1/1/2oz.
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special
care must be paid to thermal dissipation issues in board design.
The value of
θ
JA of this product can vary significantly, depending on PCB material, layout, and environmental conditions. In applications where high maximum
power dissipation exists (high V
IN, high IOUT), special care must be paid to thermal dissipation issues. For more information on these topics, please refer to
Application Note 1187: Leadless Leadframe Package (LLP) and the Power Efficiency and Power Dissipation section of this datasheet.
Note 8:
Min. and Max are guaranteed by design, test and/or statistical analysis. All electrical characteristics having room-temperature limits are tested during
production with T
J = 25°C. All hot and cold limits are guaranteed by correlating the electrical characteristics to process and temperature variations and applying
statistical process control.
Note 9:
Guaranteed by design.
Note 10:
Input voltage range for all voltage options is 2.7V to 5.5V. The voltage range recommended for the specified output voltages:
V
IN = 2.7V to 5.5V for 1V ≤ VOUT ≤ 1.7V and for VOUT = 1.8V or greater, VIN = VOUT + 1V
or
V
IN,MIN = ILOAD * (RDSON_PFET + RDCR_INDUCTOR) + VOUT
Note 11:
Test condition: for V
OUT less than 2.5V, VIN = 3.6V; for VOUT greater than or equal to 2.5V, VIN = VOUT + 1V.
Dissipation Rating Table
θ
JA
T
A = 60°C
Power Rating
T
A = 85°C
Power Rating
26°C/W (4-Layer Board) LLP-16
1538 mW
50°C/W (4-Layer Board) 20-bump micro SMD
1300 mW
800 mW
7
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LM3370
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