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参数资料
| 型号： | LM4871N/NOPB |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 1.5 W, 1 CHANNEL, AUDIO AMPLIFIER, PDIP8 |
| 封装： | DIP-8 |
| 文件页数： | 15/16页 |
| 文件大小： | 472K |
| 代理商： | LM4871N/NOPB |
Typical Performance Characteristics
Non-LD Specific Characteristics (Continued)
Frequency Response vs
Input Capacitor Size
Power Supply
Rejection Ratio
10000817
10000818
Open Loop
Frequency Response
Supply Current vs
Supply Voltage
10000819
10000820
Application Information
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATION
The LM4871’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air. The
result is a low voltage audio power amplifier that produces
2W at
≤ 1% THD with a 4 load. This high power is achieved
through careful consideration of necessary thermal design.
Failing to optimize thermal design may compromise the
LM4871’s high power performance and activate unwanted,
though necessary, thermal shutdown protection.
The LD package must have its DAP soldered to a copper
pad on the PCB. The DAP’s PCB copper pad is connected to
a large plane of continuous unbroken copper. This plane
forms a thermal mass, heat sink, and radiation area. Place
the heat sink area on either outside plane in the case of a
two-sided PCB, or on an inner layer of a board with more
than two layers. Connect the DAP copper pad to the inner
layer or backside copper heat sink area with 4(2x2) vias. The
via diameter should be 0.012in-0.013in with a 1.27mm pitch.
Ensure efficient thermal conductivity by plating through the
vias.
Best thermal performance is achieved with the largest prac-
tical heat sink area. If the heatsink and amplifier share the
same PCB layer, a nominal 2.5in
2 area is necessary for 5V
operation with a 4
load. Heatsink areas not placed on the
same PCB layer as the LM4871 should be 5in
2 (min) for the
same supply voltage and load resistance. The last two area
recommendations apply for 25C ambient temperature. In-
crease the area to compensate for ambient temperatures
above 25C. The LM4871’s power de-rating curve in the
Typical Performance Characteristics shows the maximum
power dissipation versus temperature. An example PCB lay-
out for the LD package is shown in the Demonstration
Board Layout section. Further detailed and specific infor-
mation concerning PCB layout, fabrication, and mounting an
LM4871
www.national.com
8
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| LM4872IBPX/NOPB | 1 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA8 |
| LM4872IBP/NOPB | 1 W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA8 |
| LM4873MDC | 1.1 W, 2 CHANNEL, AUDIO AMPLIFIER, UUC |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LM4872 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:1 Watt Audio Power Amplifier in micro SMD package |
| LM4872IBP | 功能描述:IC AMP AUDIO PWR 1W MONO 8USMD RoHS:否 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Boomer® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机，2-通道（立体声） 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C，麦克风，静音，短路保护，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) |
| LM4872IBPX | 功能描述:IC AMP AUDIO PWR 1W MONO 8USMD RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Boomer® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机，2-通道（立体声） 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C，麦克风，静音，短路保护，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) |
| LM4872ITP | 制造商:Texas Instruments 功能描述:AMP AUDIO 1W BOOMER SMD 4872 |
| LM4872ITP/NOPB | 功能描述:IC AMP AUDIO PWR 1W MONO 8USMD RoHS:是 类别:集成电路 (IC) >> 线性 - 音頻放大器 系列:Boomer® 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:2,500 系列:DirectDrive® 类型:H 类 输出类型:耳机，2-通道（立体声） 在某负载时最大输出功率 x 通道数量:35mW x 2 @ 16 欧姆 电源电压:1.62 V ~ 1.98 V 特点:I²C，麦克风，静音，短路保护，音量控制 安装类型:表面贴装 供应商设备封装:25-WLP（2.09x2.09） 封装/外壳:25-WFBGA，WLCSP 包装:带卷 (TR) |
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