参数资料
型号: LMH6618MK/NOPB
厂商: National Semiconductor
文件页数: 12/38页
文件大小: 0K
描述: IC OP AMP SGL VF RRIO TSOT23-6
标准包装: 1,000
系列: PowerWise®
放大器类型: 电压反馈
电路数: 1
输出类型: 满摆幅
转换速率: 57 V/µs
增益带宽积: 65MHz
-3db带宽: 140MHz
电流 - 输入偏压: 1.5µA
电压 - 输入偏移: 100µV
电流 - 电源: 1.35mA
电流 - 输出 / 通道: 35mA
电压 - 电源,单路/双路(±): 2.7 V ~ 11 V,±1.35 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: SOT-23-6 细型,TSOT-23-6
供应商设备封装: TSOT-23-6
包装: 带卷 (TR)
产品目录页面: 1270 (CN2011-ZH PDF)
配用: 551600083-001-ND - BOARD FOR SOT23 LMH6611/18
其它名称: LMH6618MK
LMH6618MK-ND
LMH6618MKTR
LMH6618
ADC121S101
0.1 PF
C6
10 PF
C5
0.1 PF
C13
10 PF
C11
0.1 PF
V
+
0.01 PF
14.3 k:
0.1 PF
1 PF
GND
5V
1.24 k:
1 nF
150 pF
549:
V
+
-
+
22:
390 pF
549:
IN
1 PF
V
+
14.3 k:
5.6 PF
SNOSAV7E – AUGUST 2007 – REVISED OCTOBER 2012
Typical Application
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
ESD Tolerance (2)
Human Body Model
For input pins only
2000V
For all other pins
2000V
Machine Model
200V
Supply Voltage (VS = V
+ – V)
12V
Junction Temperature (3)
150°C max
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2)
Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(3)
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
OPERATING RATINGS
(1)
Supply Voltage (VS = V
+ – V)
2.7V to 11V
Ambient Temperature Range (2)
40°C to +125°C
Package Thermal Resistance (
θJA)
6-Pin SOT (DDC0006A)
231°C/W
8-Pin SOIC (D0008A)
160°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2)
The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
2
Copyright 2007–2012, Texas Instruments Incorporated
Product Folder Links: LMH6618 LMH6619
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