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参数资料
| 型号： | LMH6734MQX/NOPB |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 音频／视频放大 |
| 英文描述： | 3 CHANNEL, VIDEO AMPLIFIER, PDSO16 |
| 封装： | ROHS COMPLIANT, SSOP-16 |
| 文件页数： | 8/18页 |
| 文件大小： | 561K |
| 代理商： | LMH6734MQX/NOPB |
on heat-sink can be added to the 16-Pin SSOP package, or
alternatively, additional board metal (copper) area can be uti-
lized as heat-sink.
An effective way to reduce the junction temperature for the
16-Pin SSOP package (and other plastic packages) is to use
the copper board area to conduct heat. With no enhancement
the major heat flow path in this package is from the die
through the metal lead frame (inside the package) and onto
the surrounding copper through the interconnecting leads.
Since high frequency performance requires limited metal near
the device pins the best way to use board copper to remove
heat is through the bottom of the package. A gap filler with
high thermal conductivity can be used to conduct heat from
the bottom of the package to copper on the circuit board. Vias
to a ground or power plane on the back side of the circuit
board will provide additional heat dissipation. A combination
of front side copper and vias to the back side can be combined
as well.
Follow these steps to determine the maximum power dissi-
pation for the LMH6734:
1.
Calculate the quiescent (no-load) power: P
AMP = ICC X
(V
S) VS = V
+
-V
2.
Calculate the RMS power dissipated in the output stage:
P
D (rms) = rms ((VS - VOUT) X IOUT) where VOUT and
I
OUT are the voltage and current across the external load
and V
S is the total supply current
3.
Calculate the total RMS power: P
T = PAMP+PD
The maximum power that the LMH6734 package can dissi-
pate at a given temperature (See Figure 14) can be derived
with the following equation:
P
MAX = (150° C/W – TAMB)/ θJA, where TAMB = Ambient tem-
perature (°C) and
θ
JA = Thermal resistance, from junction to
ambient, for a given package (°C/W). For the SSOP package
θ
JA is 120°C/W.
30003602
FIGURE 14. Maximum Power Dissipation
ESD PROTECTION
The LMH6734 is protected against electrostatic discharge
(ESD) on all pins. The LMH6734 will survive 2000V Human
Body Model and 200V Machine Model events.
Under closed loop operation the ESD diodes have no affect
on circuit performance. There are occasions, however, when
the ESD diodes will be evident. If the LMH6734 is driven by
a large signal while the device is powered down the ESD
diodes will conduct.
The current that flows through the ESD diodes will either exit
the chip through the supply pins or will flow through the de-
vice, hence it is possible to power up a chip with a large signal
applied to the input pins. Shorting the power pins to each other
will prevent the chip from being powered up through the input.
www.national.com
16
LMH6734
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LMH6738 | 制造商:NSC 制造商全称:National Semiconductor 功能描述:Very Wideband, Low Distortion Triple Op Amp |
| LMH6738MQ | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LMH6738MQ/NOPB | 功能描述:运算放大器 - 运放 Triple Video Op-Amp RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LMH6738MQX | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
| LMH6738MQX/NOPB | 功能描述:运算放大器 - 运放 RoHS:否 制造商:STMicroelectronics 通道数量:4 共模抑制比（最小值）:63 dB 输入补偿电压:1 mV 输入偏流（最大值）:10 pA 工作电源电压:2.7 V to 5.5 V 安装风格:SMD/SMT 封装 / 箱体:QFN-16 转换速度:0.89 V/us 关闭:No 输出电流:55 mA 最大工作温度:+ 125 C 封装:Reel |
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