参数资料
型号: LMV331SQ3T2G
厂商: ON Semiconductor
文件页数: 8/20页
文件大小: 0K
描述: IC COMPARATOR GP LV SINGLE SC-70
标准包装: 3,000
类型: 通用
元件数: 1
输出类型: 开路漏极
电压 - 电源,单路/双路(±): 2.7 V ~ 5 V
电压 - 输入偏移(最小值): 9mV @ 5V
电流 - 输入偏压(最小值): 0.001µA @ 5V
电流 - 输出(标准): 84mA @ 5V
电流 - 静态(最大值): 150µA
传输延迟(最大): 1.5µs
封装/外壳: 6-TSSOP(5 引线),SC-88A,SOT-353
安装类型: 表面贴装
包装: 带卷 (TR)
其它名称: LMV331SQ3T2G-ND
LMV331SQ3T2GOSTR
LMV331, NCV331, LMV393, LMV339
http://onsemi.com
16
PACKAGE DIMENSIONS
Micro8t
CASE 846A02
ISSUE H
S
B
M
0.08 (0.003)
A S
T
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
b
e
PIN 1 ID
8 PL
0.038 (0.0015)
T
SEATING
PLANE
A
A1
c
L
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8X
6X
mm
inches
SCALE 8:1
1.04
0.041
0.38
0.015
5.28
0.208
4.24
0.167
3.20
0.126
0.65
0.0256
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
1.10
INCHES
A1
0.05
0.08
0.15
0.002
b
0.25
0.33
0.40
0.010
c
0.13
0.18
0.23
0.005
D
2.90
3.00
3.10
0.114
E
2.90
3.00
3.10
0.114
e
0.65 BSC
L
0.40
0.55
0.70
0.016
0.043
0.003
0.006
0.013
0.016
0.007
0.009
0.118
0.122
0.118
0.122
0.026 BSC
0.021
0.028
NOM
MAX
4.75
4.90
5.05
0.187
0.193
0.199
HE
HE
D
E
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