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参数资料
| 型号： | LMZ14201EXTTZ |
| 厂商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分类： | 稳压器 |
| 英文描述： | SWITCHING REGULATOR, 1000 kHz SWITCHING FREQ-MAX, PSSO7 |
| 封装： | 10.16 X 13.77 MM, 4.57 MM HEIGHT, ROHS COMPLIANT, TO-PMOD, 7 PIN |
| 文件页数： | 4/18页 |
| 文件大小： | 3945K |
| 代理商： | LMZ14201EXTTZ |
The next on-time period starts when the voltage on the at the
FB pin falls below the internal reference. The switching fre-
quency is lower in DCM and varies more with load current as
compared to CCM. Conversion efficiency in DCM is main-
tained since conduction and switching losses are reduced
with the smaller load and lower switching frequency. Operat-
ing frequency in DCM can be calculated as follows:
f
SW(DCM)VO*(VIN-1)*10μH*1.18*10
20
*I
O/(VIN–VO)*RON
2 (15)
In CCM, current flows through the inductor through the entire
switching cycle and never falls to zero during the off-time. The
switching frequency remains relatively constant with load cur-
rent and line voltage variations. The CCM operating frequen-
cy can be calculated using equation 7 above.
Following is a comparison pair of waveforms of the showing
both CCM (upper) and DCM operating modes.
CCM and DCM Operating Modes
V
IN = 12V, VO = 3.3V, IO = 1 A / 0.25 A
30117612
The approximate formula for determining the DCM/CCM
boundary is as follows:
I
DCBVO*(VIN–VO)/(2*10 μH*fSW(CCM)*VIN) (16)
Following is a typical waveform showing the boundary condi-
tion.
Transition Mode Operation
V
IN = 24V, VO = 3.3V, IO = 0.29 A
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The inductor internal to the module is 10
μH. This value was
chosen as a good balance between low and high input voltage
applications. The main parameter affected by the inductor is
the amplitude of the inductor ripple current (I
LR). ILR can be
calculated with:
I
LR P-P=VO*(VIN- VO)/(10H*fSW*VIN) (17)
Where V
IN is the maximum input voltage and fSW is deter-
mined from equation 10.
If the output current I
O is determined by assuming that IO =
I
L, the higher and lower peak of ILR can be determined. Be
aware that the lower peak of I
LR must be positive if CCM op-
eration is required.
POWER DISSIPATION AND BOARD THERMAL
REQUIREMENTS
For the design case of V
IN = 24V, VO = 3.3V, IO = 1A, TAMB
(MAX) = 85°C , and TJUNCTION = 125°C, the device must see a
thermal resistance from case to ambient of less than:
θ
CA< (TJ-MAX — TAMB(MAX)) / PIC-LOSS - θJC (18)
Given the typical thermal resistance from junction to case to
be 1.9 °C/W. Use the 85°C power dissipation curves in the
Typical Performance Characteristics section to estimate the
P
IC-LOSS for the application being designed. In this application
it is 0.52W.
θ
CA = (125 — 85) / 0.52W — 1.9 = 75
To reach
θ
CA = 75, the PCB is required to dissipate heat ef-
fectively. With no airflow and no external heat, a good esti-
mate of the required board area covered by 1 oz. copper on
both the top and bottom metal layers is:
Board Area_cm2 = 500°C x cm2/W /
θ
JC (19)
As a result, approximately 6 square cm of 1 oz copper on top
and bottom layers is required for the PCB design. Additional
area will decrease die temperature proportionately. The PCB
copper heat sink must be connected to the exposed pad. Ap-
proximately thirty six, 10mils (254
μm) thermal vias spaced
59mils (1.5 mm) apart must connect the top copper to the
bottom copper. For an example of a high thermal performance
PCB layout of approximately 31 square cm area. Refer to the
Evaluation Board application note AN-2024. For more infor-
mation on thermal design see AN-2020 and AN-2026.
PC BOARD LAYOUT GUIDELINES
PC board layout is an important part of DC-DC converter de-
sign. Poor board layout can disrupt the performance of a DC-
DC converter and surrounding circuitry by contributing to EMI,
ground bounce and resistive voltage drop in the traces. These
can send erroneous signals to the DC-DC converter resulting
in poor regulation or instability. Good layout can be imple-
mented by following a few simple design rules.
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1. Minimize area of switched current loops.
From an EMI reduction standpoint, it is imperative to minimize
the high di/dt paths during PC board layout. The high current
loops that do not overlap have high di/dt content that will
cause observable high frequency noise on the output pin if
the input capacitor (Cin1) is placed at a distance away from
the LMZ14201EXT. Therefore place C
IN1 as close as possible
www.national.com
12
LMZ14201EXT
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LMZ14201EXTTZ/NOPB | 功能描述:直流/直流开关转换器 1A SIMPLE SWITCHER POWER MOD, 42V MAX RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| LMZ14201EXTTZE | 制造商:NSC 制造商全称:National Semiconductor 功能描述:1A SIMPLE SWITCHER? Power Module with 42V Maximum Input Voltage for Military and Rugged Applications |
| LMZ14201EXTTZE/NOPB | 功能描述:直流/直流开关转换器 RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
| LMZ14201EXTTZX | 制造商:NSC 制造商全称:National Semiconductor 功能描述:1A SIMPLE SWITCHER? Power Module with 42V Maximum Input Voltage for Military and Rugged Applications |
| LMZ14201EXTTZX/NOPB | 功能描述:直流/直流开关转换器 RoHS:否 制造商:STMicroelectronics 最大输入电压:4.5 V 开关频率:1.5 MHz 输出电压:4.6 V 输出电流:250 mA 输出端数量:2 最大工作温度:+ 85 C 安装风格:SMD/SMT |
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