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| 型号： | LMZ14201TZX-ADJ/NOPB |
| 厂商： | National Semiconductor |
| 文件页数： | 15/27页 |
| 文件大小： | 0K |
| 描述： | IC BUCK SYNC ADJ 1A TO-PMOD-7 |
| 产品培训模块： | LMZ Power Modules SIMPLE SWITCHER® Regulators SIMPLE SWITCHER Power Modules |
| 视频文件： | Power Design Invitational - Another Geek Moment |
| 标准包装： | 500 |
| 系列： | SIMPLE SWITCHER® |
| 类型： | 非隔离（POL） |
| 输出数： | 1 |
| 电压 - 输入（最小）： | 6V |
| 电压 - 输入（最大）： | 42V |
| Voltage - Output 1： | 0.8 ~ 6 V |
| 电流 - 输出（最大）： | 1A |
| 电源（瓦） - 制造商系列： | 6W |
| 特点： | 带有 UVLO |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-PMOD-7，电源模块 |
| 尺寸/尺寸： | 0.40" L x 0.54" W x 0.18" H（10.2mm x 13.8mm x 4.6mm） |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 125°C |
| 效率： | 90% |
| 电源（瓦特）- 最大： | 6W |
| 其它名称： | LMZ14201TZX-ADJ |
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LMZ14201
www.ti.com
SNVS649F – JANUARY 2010 – REVISED OCTOBER 2013
Following is a comparison pair of waveforms of the showing both CCM (upper) and DCM operating modes.
Figure 33. CCM and DCM Operating Modes
V IN = 12V, V O = 3.3V, I O = 1 A / 0.25 A
500 mA/Div
2.00 2 s/Div
The approximate formula for determining the DCM/CCM boundary is as follows:
I DCB ? V O *(V IN –V O )/(2*10 μ H*f SW(CCM) *V IN )
Following is a typical waveform showing the boundary condition.
Figure 34. Transition Mode Operation
V IN = 24V, V O = 3.3V, I O = 0.29 A
(16)
500 mA/Div
2.00 2 s/Div
The inductor internal to the module is 10 μ H. This value was chosen as a good balance between low and high
input voltage applications. The main parameter affected by the inductor is the amplitude of the inductor ripple
current (I LR ). I LR can be calculated with:
I LR P-P =V O *(V IN - V O )/(10μH*f SW *V IN )
(17)
Where V IN is the maximum input voltage and f SW is determined from Equation 10 .
If the output current I O is determined by assuming that I O = I L , the higher and lower peak of I LR can be
determined. Be aware that the lower peak of I LR must be positive if CCM operation is required.
POWER DISSIPATION AND BOARD THERMAL REQUIREMENTS
For the design case of V IN = 24V, V O = 3.3V, I O = 1A, T AMB(MAX) = 85°C , and T JUNCTION = 125°C, the device must
see a thermal resistance from case to ambient of less than:
θ CA < (T J-MAX — T AMB(MAX) ) / P IC-LOSS - θ JC
(18)
Given the typical thermal resistance from junction to case to be 1.9 °C/W. Use the 85°C power dissipation curves
in the Typical Performance Characteristics section to estimate the P IC-LOSS for the application being designed. In
this application it is 0.52W.
θ CA = (125 — 85) / 0.52W — 1.9 = 75
To reach θ CA = 75, the PCB is required to dissipate heat effectively. With no airflow and no external heat, a good
estimate of the required board area covered by 1 oz. copper on both the top and bottom metal layers is:
Board Area_cm 2 = 500°C x cm 2 /W / θ JC
(19)
Copyright ? 2010–2013, Texas Instruments Incorporated
Product Folder Links: LMZ14201
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