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| 型号： | LP3875ET-ADJ/NOPB |
| 厂商： | National Semiconductor |
| 文件页数： | 11/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 1.5A TO220-5 |
| 标准包装： | 45 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 2.5 V ~ 7 V |
| 电压 - 压降（标准）： | 0.38V @ 1.5A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 1.5A（最小值） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-220-5 成形引线 |
| 供应商设备封装： | TO-220-5 |
| 包装： | 管件 |
| 其它名称： | *LP3875ET-ADJ *LP3875ET-ADJ/NOPB LP3875ET-ADJ |
SNVS247D – SEPTEMBER 2003 – REVISED APRIL 2013
In this equation, θ CH is the thermal resistance from the case to the surface of the heat sink and θ JC is the thermal
resistance from the junction to the surface of the case. θ JC is about 3°C/W for a TO-220 package. The value for
θ CH depends on method of attachment, insulator, etc. θ CH varies between 1.5°C/W to 2.5°C/W. If the exact value
is unknown, 2°C/W can be assumed.
HEATSINKING DDPAK/TO-263 PACKAGE
The DDPAK/TO-263 package uses the copper plane on the PCB as a heatsink. The tab of these packages are
soldered to the copper plane for heat sinking. Figure 17 shows a curve for the θ JA of DDPAK/TO-263 package for
different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area
for heat sinking.
Figure 17. θ JA vs Copper (1 Ounce) Area for DDPAK/TO-263 Package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The
minimum value for θ JA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.
Figure 18 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient
temperatures, assuming θ JA is 35°C/W and the maximum junction temperature is 125°C.
Figure 18. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 Package
HEATSINKING SOT-223-5 PACKAGE
Figure 19 shows a curve for the θ JA of SOT-223 package for different copper area sizes, using a typical PCB with
1 ounce copper and no solder mask over the copper area for heat sinking.
Copyright ? 2003–2013, Texas Instruments Incorporated
Product Folder Links: LP3875-ADJ
11
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