参数资料
型号: LPC1311FHN33,551
厂商: NXP Semiconductors
文件页数: 58/74页
文件大小: 0K
描述: IC MCU 32BIT 8KB FLASH 33HVQFN
产品培训模块: LPCXpresso
特色产品: LPC1300 Series Cortex-M3 MCUs
标准包装: 260
系列: LPC13xx
核心处理器: ARM? Cortex?-M3
芯体尺寸: 32-位
速度: 72MHz
连通性: I²C,Microwire,SPI,SSI,UART/USART
外围设备: 欠压检测/复位,POR,WDT
输入/输出数: 28
程序存储器容量: 8KB(8K x 8)
程序存储器类型: 闪存
RAM 容量: 4K x 8
电压 - 电源 (Vcc/Vdd): 2 V ~ 3.6 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 33-VQFN 裸露焊盘,33-HVQFN,33-SQFN,33-DHVQFN
包装: 托盘
配用: 622-1005-ND - USB IN-CIRCUIT PROG ARM7 LPC2K
其它名称: 568-4915
935289654551
LPC1311_13_42_43
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 6 June 2012
61 of 74
NXP Semiconductors
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller
11.3 XTAL Printed-Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
Table 21.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
1 MHz - 5 MHz
10 pF
< 300
Ω
18 pF, 18 pF
20 pF
< 300
Ω
39 pF, 39 pF
30 pF
< 300
Ω
57 pF, 57 pF
5 MHz - 10 MHz
10 pF
< 300
Ω
18 pF, 18 pF
20 pF
< 200
Ω
39 pF, 39 pF
30 pF
< 100
Ω
57 pF, 57 pF
10 MHz - 15 MHz
10 pF
< 160
Ω
18 pF, 18 pF
20 pF
< 60
Ω
39 pF, 39 pF
15 MHz - 20 MHz
10 pF
< 80
Ω
18 pF, 18 pF
Table 22.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters) high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz - 20 MHz
10 pF
< 180
Ω
18 pF, 18 pF
20 pF
< 100
Ω
39 pF, 39 pF
20 MHz - 25 MHz
10 pF
< 160
Ω
18 pF, 18 pF
20 pF
< 80
Ω
39 pF, 39 pF
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