参数资料
型号: LPC2101FBD48,151
厂商: NXP Semiconductors
文件页数: 28/37页
文件大小: 0K
描述: IC ARM7 MCU FLASH 8K 48-LQFP
产品培训模块: Migrating from 8/16-Bit MCUs to 32-Bit ARMs
ARM7 Architecture
ARM7 Memory
标准包装: 250
系列: LPC2100
核心处理器: ARM7
芯体尺寸: 16/32-位
速度: 70MHz
连通性: I²C,Microwire,SPI,SSI,SSP,UART/USART
外围设备: POR,PWM,WDT
输入/输出数: 32
程序存储器容量: 8KB(8K x 8)
程序存储器类型: 闪存
RAM 容量: 2K x 8
电压 - 电源 (Vcc/Vdd): 1.65 V ~ 3.6 V
数据转换器: A/D 8x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 48-LQFP
包装: 托盘
产品目录页面: 704 (CN2011-ZH PDF)
配用: 568-4310-ND - EVAL BOARD LPC2158 W/LCD
568-4297-ND - BOARD EVAL LPC21XX MCB2100
MCB2103UME-ND - BOARD EVAL MCB2103 + ULINK-ME
MCB2103U-ND - BOARD EVAL MCB2103 + ULINK2
622-1005-ND - USB IN-CIRCUIT PROG ARM7 LPC2K
其它名称: 568-2092
935280963151
LPC2101FBD48-S
PIC18F85J90 FAMILY
DS39770C-page 34
2010 Microchip Technology Inc.
2.6
External Oscillator Pins
Many microcontrollers have options for at least two
oscillators: a high-frequency primary oscillator and a
low-frequency
secondary
oscillator
(refer
to
The oscillator circuit should be placed on the same
side of the board as the device. Place the oscillator
circuit close to the respective oscillator pins with no
more than 0.5 inch (12 mm) between the circuit
components and the pins. The load capacitors should
be placed next to the oscillator itself, on the same side
of the board.
Use a grounded copper pour around the oscillator cir-
cuit to isolate it from surrounding circuits. The
grounded copper pour should be routed directly to the
MCU ground. Do not run any signal traces or power
traces inside the ground pour. Also, if using a two-sided
board, avoid any traces on the other side of the board
where the crystal is placed.
Layout suggestions are shown in Figure 2-4. In-line
packages may be handled with a single-sided layout
that completely encompasses the oscillator pins. With
fine-pitch packages, it is not always possible to com-
pletely surround the pins and components. A suitable
solution is to tie the broken guard sections to a mirrored
ground layer. In all cases, the guard trace(s) must be
returned to ground.
In planning the application’s routing and I/O assign-
ments, ensure that adjacent port pins and other signals
in close proximity to the oscillator are benign (i.e., free
of high frequencies, short rise and fall times, and other
similar noise).
For additional information and design guidance on
oscillator circuits, please refer to these Microchip
Application Notes, available at the corporate web site
(www.microchip.com):
AN826, “Crystal Oscillator Basics and Crystal
Selection for rfPIC and PICmicro Devices”
AN849, “Basic PICmicro Oscillator Design”
AN943, “Practical PICmicro Oscillator Analysis
and Design”
AN949, “Making Your Oscillator Work”
2.7
Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state. Alternatively, connect a 1 k
to 10 k resistor to VSS on unused pins and drive the
output to logic low.
FIGURE 2-4:
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
GND
`
OSC1
OSC2
T1OSO
T1OS I
Copper Pour
Primary Oscillator
Crystal
Timer1 Oscillator
Crystal
DEVICE PINS
Primary
Oscillator
C1
C2
T1 Oscillator: C1
T1 Oscillator: C2
(tied to ground)
Single-Sided and In-Line Layouts:
Fine-Pitch (Dual-Sided) Layouts:
GND
OSCO
OSCI
Bottom Layer
Copper Pour
Oscillator
Crystal
Top Layer Copper Pour
C2
C1
DEVICE PINS
(tied to ground)
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