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参数资料
| 型号： | LPS1100H47R0JB |
| 厂商： | Vishay Sfernice |
| 文件页数： | 3/5页 |
| 文件大小： | 0K |
| 描述： | RESISTOR HEAT SINK 47 OHM 1100W |
| 标准包装： | 15 |
| 系列： | LPS1100 |
| 电阻（欧姆）： | 47 |
| 功率（瓦特）： | 1100W |
| 复合体： | 厚膜 |
| 特点： | 非电感 |
| 温度系数： | ±150ppm/°C |
| 容差： | ±5% |
| 安装特点： | 法兰 |
| 尺寸/尺寸： | 2.362" L x 2.244" W（60.00mm x 57.00mm） |
| 高度： | 1.000"（25.40mm） |
| 引线型： | M4 螺纹 |
| 包装： | 散装 |
| 封装/外壳： | 盒 |
| 其它名称： | LPS-47.0D |
LPS 1100
www.vishay.com
Vishay Sfernice
CONFIG. 1:
WATER COOLING
HEATSINK CP15 AND
THERMAL GREASE
BLUESIL PAST 340
CONFIG. 2:
AIR COOLING
HEATSINK P207/250 AND
THERMAL GREASE
BLUESIL PAST 340
CONFIG. 3:
WATER COOLING
HEATSINK CP15 AND
THERMAL PAD Q-PAD II
CONFIG. 4:
AIR COOLING
HEATSINK P207/250 AND
THERMAL PAD Q-PAD II
Power Dissipation (W)
T° Resistive Element (°C)
R th(j-c) max. (°C/W)
R th(c-h) typ. (°C/W)
R th(h-a) max. (°C/W)
Fluid T° (°C)
1100
200
0.039
0.070
0.059
15 (water)
350 650 285
200 200 200
0.039 0.039 0.039
0.201 0.187 0.315
0.260 0.059 0.260
25 (air) 15 (water) 25 (air)
Note
? Configuration 1: Water cooling heatsink (CP15 from Lytron (304 mm x 95.3 mm x 8 mm) with water flow rate 4LPM and thermal grease Bluesil
Past 340 from BlueStar Silicones
Configuration 2: Air cooling heatsink P207/250 from Semikron (250 mm x 200 mm x 72 mm) and thermal grease Bluesil Past 340 from
BlueStar Silicones
Configuration 3: Water cooling heatsink (CP15 from Lytron (304 mm x 95.3 mm x 8 mm) with water flow rate 4LPM and thermal pad
Q-pad II from Berquist
Configuration 4: Air cooling heatsink P207/250 from Semikron (250 mm x 200 mm x 72 mm) and thermal pad Q-pad II from Berquist
OVERLOAD
In any case the applied voltage must be lower than
U I = 6600 V.
Short time overload: 2 x Pr/10 s for heatsink with
R th(h-a) ≥ 0.26 °C/W (maximum power: 700 W) and 1.6 x
Pr/1 s for heatsink with 0.26 °C/W > R th(h-a) ≥ 0.059 °C/W
(maximum power: 1800 W).
Accidental overload: The values indicated on the following
graph are applicable to resistors in air or mounted onto a
heatsink.
ENERGY CURVE
MARKING
Series, style, ohmic value (in Ω ), tolerance (in %),
manufacturing date, Vishay Sfernice trademark.
POWER RATING
The temperature of the case should be maintained within
the limit specified in the following figure. To optimize
the thermal conduction, contacting surfaces should be
coated with silicone grease or thermal film, and heatsink
mounting screws tightened to 2 Nm.
10 000
100
1000
100
10
80
60
40
20
1
0.0001
0.001
0.01
0.1
1
10
100
OVERLOAD DURATION IN ms
0
0
25
50
75
100
125
150
1 7 5
200
POWER CURVE
100 000
10 000
PACKAGING
HEATSINK TEMPERATURE IN °C
Box of 15 units
1000
100
10
1
0.0001
0.001
0.01
0.1
1
10
100
OVERLOAD DURATION IN ms
Revision: 24-Oct-13
3
Document Number: 50059
For technical questions, contact: sferfixedresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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