参数资料
型号: LSM2-T/6-W3-C
厂商: Murata Power Solutions Inc
文件页数: 10/17页
文件大小: 0K
描述: CONV DC/DC 19.8W 6A 5V SMD
标准包装: 1
系列: LSM2
类型: 非隔离(POL)
输出数: 1
电压 - 输入(最小): 2.4V
电压 - 输入(最大): 5.5V
Voltage - Output 1: 0.75 ~ 3.3 V
电流 - 输出(最大): 6A
电源(瓦) - 制造商系列: 19W
安装类型: 表面贴装
封装/外壳: 8-DIP SMD 模块
尺寸/尺寸: 1.30" L x 0.53" W x 0.34" H(33.0mm x 13.5mm x 8.6mm)
包装: 标准包装
工作温度: -40°C ~ 85°C
效率: 95.5%
电源(瓦特)- 最大: 19.8W
产品目录页面: 2719 (CN2011-ZH PDF)
其它名称: 811-1781-6
LSM2 Series
Single Output, Non-Isolated
Selectable-Output POL DC/DC Converters
Tape & Reel Surface Mount Package
MPS’s LSM2 series DC/DC converters are the only higher-current (16A) SMT
DC/DC's that can be automatically “pick-and-placed” using standard vacuum-
pickup equipment (nozzle size and style, vacuum pressure and placement
speed may need to be optimized for automated pick and place) and subse-
quently re?owed using high-temperature, lead-free solder.
Virtually all SMT DC/DCs today are unprotected "open-frame" devices as-
sembled by their vendors with high-temperature solder (usually Sn96.5/Ag3.5
with a melting point +221°C) so that you may attach them to your board using
low-temperature solder (usually Sn63/Pb37 with a melting point of +183°C).
Conceptually straightforward, this "stepped" solder approach has its limita-
tions, and it is clearly out of step with an industry trending toward the broad
use of lead-free solders. Are you to experiment and develop re?ow pro?les
from other vendors that ensure the components on those DC/DC never exceed
215-216°C? If those components get too hot, "double-re?ow" could compro-
mise the reliability of their solder joints. Virtually all these devices demand you
"cool down" the Sn63 pro?le you are likely using today.
MPS is not exempted from the Laws of Physics, and we do not have
magic solders no one else has. Nevertheless, we have a simple and practical,
straightforward approach that works. We assemble our LSM2 SMT DC/DC's
using a high-temperature (+216°C), lead-free alloy (Sn96.2%, Ag2.5%, Cu0.8%,
Sb0.5%). The LSM2 design ensures co-planarity to within 0.004 inches
(100μ1m) of the unit's tin-plated (150 micro-inches) copper leads. See Me-
chanical Data for additional information.
The disposable heat shield (patent pending), which has a cutaway expos-
ing the package leads, provides thermal insulation to internal components
during re?ow and its smooth surface ideally doubles as the vacuum pick-up
location also. The insulation properties of the heat shield are so effective
that temperature differentials as high as 50°C develop inside-to-outside the
shield. Oven temperature pro?les with peaks of 250-260°C and dwell times
exceeding 2 minutes above 221°C (the melting point of Sn96.5/Ag3.5) are
easily achieved.
250
221
200
183
Sn96.5/Ag3.5 Melting Point
Sn63/Pb37 Melting Point
HEAT SHIELD OUTSIDE TEMPERATURE
150
PCB TEMPERATURE INSIDE THE HEAT SHIELD
100
50
0
50
100
150
200
250
300
350
400
Time (Seconds)
Figure 6. Re?ow Solder Pro?le
www.murata-ps.com/support
M D C_LSM2 Series.C01 Δ Page 10 of 17
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