参数资料
| 型号： | LT1083CP-12 |
| 厂商： | Linear Technology |
| 文件页数： | 9/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 12V 7.5A TO-3P-3 |
| 标准包装： | 30 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 12V |
| 输入电压： | 最高 25V |
| 电压 - 压降（标准）： | 1.3V @ 7.5A |
| 稳压器数量： | 1 |
| 电流 - 输出： | 7.5A |
| 电流 - 限制（最小）： | 8A |
| 工作温度： | 0°C ~ 150°C |
| 安装类型： | 通孔 |
| 封装/外壳： | TO-247-3 |
| 供应商设备封装： | TO-247-3 |
| 包装： | 散装 |
LT1083/LT1084/LT1085 Fixed
APPLICATIO S I FOR ATIO
case- to-heat sink interface, and heat sink resistance itself.
New thermal resistance specifications have been devel-
oped to more accurately reflect device temperature and
ensure safe operating temperatures. The data section for
these new regulators provides a separate thermal resis-
tance and maximum junction temperature for both the
Control Section and the Power Section. Previous regula-
tors, with a single junction-to-case thermal resistance
specification, used an average of the two values provided
here and therefore could allow excessive junction tem-
peratures under certain conditions of ambient tempera-
ture and heat sink resistance. To avoid this possibility,
calculations should be made for both sections to ensure
that both thermal limits are met.
Junction-to-case thermal resistance is specified from the
IC junction to the bottom of the case directly below the die.
This is the lowest resistance path for heat flow. Proper
mounting is required to ensure the best possible thermal
flow from this area of the package to the heat sink. Thermal
compound at the case-to-heat sink interface is strongly
recommended. If the case of the device must be electroni-
cally isolated, a thermally conductive spacer can be used
as long as its added contribution to thermal resistance is
considered. Note that the case of all devices in this series
is electronically connected to the ouput.
TYPICAL APPLICATIO S
High Efficiency Regulator
For example, using a LT1083-5CP (TO-3P, Commercial)
and assuming:
V IN (max continuous) = 9V, V OUT = 5V, I OUT = 6A,
T A = 75 ° C, θ HEAT SINK = 1 ° C/W,
θ CASE-TO-HEAT SINK = 0.2 ° C/W for P package with
thermal compound.
Power dissipation under these conditions is equal to:
P D = (V IN – V OUT ) (I OUT ) = 24W
Junction temperature will be equal to:
T J = T A + P D ( θ HEAT SINK + θ CASE-TO-HEAT SINK + θ JC )
For the Control Section:
T J = 75 ° C + 24W (1 ° C/W + 0.2 ° C/W + 0.5 ° C/W) =
118 ° C
118 ° C < 125 ° C = T JMAX (Control Section Commer-
cial Range)
For the Power Transistor:
T J = 75 ° C + 24W (1 ° C/W + 0.2 ° C/W + 1.6 ° C/W) =
142 ° C
142 ° C < 150 ° C = T JMAX (Power Transistor Commer-
cial Range)
In both cases the junction temperature is below the
maximum rating for the respective sections, ensuring
reliable operation.
Paralleling Regulators
28V
INPUT
10k
1mH
10,000 μ F
MR1122
+
IN
470 Ω
LT1083-5 OUT
GND
OUTPUT
V IN
IN
LT1083-5 OUT
GND
2 FEET #18 WIRE*
V OUT = 5V
I OUT = 0A TO 15A
28V
1N914
IN
LT1083-5 OUT
0.015 Ω
*THE #18 WIRE ACTS
GND
AS BALLAST RESISTANCE
1k
1M
+
4N28
10k
LT1083/4/5 TA03
INSURING CURRENT SHARING
BETWEEN BOTH DEVICES
LT1083/4/5 TA04
LT1011
–
10k
28V
1N914
1083ffd
9
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相关代理商/技术参数 |
参数描述 |
|---|---|
| LT1083CP-12#PBF | 功能描述:IC REG LDO 12V 7.5A TO-3P-3 RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA（最小值） 电流 - 限制（最小）:360mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
| LT1083CP-12PBF | 制造商:Linear Technology 功能描述:7500mA,12V,LDO Voltage Reg.,LT1083CP-12 |
| LT1083CP5 | 制造商:Linear Technology 功能描述: |
| LT1083CP-5 | 功能描述:IC REG LDO 5V 7.5A TO-3P-3 RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:3,000 系列:- 稳压器拓扑结构:正，固定式 输出电压:2.5V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:300mA（最小值） 电流 - 限制（最小）:360mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商设备封装:TSOT-23-5 包装:带卷 (TR) |
| LT1083CP-5#PBF | 功能描述:IC REG LDO 5V 7.5A TO-3P-3 RoHS:否 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:8V 输入电压:10.5 V ~ 23 V 电压 - 压降（标准）:1.7V @ 40mA 稳压器数量:1 电流 - 输出:100mA（最小值） 电流 - 限制（最小）:- 工作温度:0°C ~ 125°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:剪切带 (CT) 产品目录页面:1075 (CN2011-ZH PDF) 其它名称:296-24390-1 |
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