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参数资料
| 型号： | LT1129MPST-3.3#TRPBF |
| 厂商： | Linear Technology |
| 文件页数： | 11/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V .7A SOT223 |
| 产品培训模块： | More Information on LDOs |
| 标准包装： | 2,000 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 4.15 V ~ 30 V |
| 电压 - 压降（标准）： | 0.45V @ 700mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 700mA |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-261-4，TO-261AA |
| 供应商设备封装： | SOT-223 |
| 包装： | 带卷 (TR) |
LT1129/LT1129-3.3/LT1129-5
OPERATION
copper. This data can be used as a rough guideline in
estimating thermal resistance. The thermal resistance for
each application will be affected by thermal interactions
with other components as well as board size and shape.
Some experimentation will be necessary to determine the
actual value.
The power dissipated by the device will be equal to:
I OUT MAX ? (V IN MAX – V OUT ) + (I GND ? V IN MAX )
where, I OUT MAX = 500mA
V IN MAX = 5.5V
I GND at (I OUT = 500mA, V IN = 5.5V) = 25mA
Table 1. Q Package, 5-Lead DD
COPPER AREA
THERMAL RESISTANCE
so,
P = 500mA ? (5.5V – 3.3V) + (25mA ? 5.5V)
= 1.24W
TOPSIDE*
BACKSIDE
BOARD AREA (JUNCTION-TO-AMBIENT)
If we use a DD package, then the thermal resistance will be
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
2500 sq. mm
2500 sq. mm
25°C/W
27°C/W
in the range of 25°C/W to 35°C/W depending on copper
area. So the junction temperature rise above ambient will
125 sq. mm
2500 sq. mm
2500 sq. mm
35°C/W
be approximately equal to:
* Tab of device attached to topside copper
Table 2. ST Package, 3-Lead SOT-223
1.24W ? 30°C/W = 37.2°C
The maximum junction temperature will then be equal to
COPPER AREA
THERMAL RESISTANCE
the maximum junction temperature rise above ambient
TOPSIDE*
BACKSIDE
BOARD AREA (JUNCTION-TO-AMBIENT)
plus the maximum ambient temperature or:
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
2500 sq. mm
2500 sq. mm
45°C/W
45°C/W
T JMAX = 50°C + 37.2°C = 87.2°C
225 sq. mm
2500 sq. mm
2500 sq. mm
53°C/W
Output Capacitance and Transient Performance
100 sq. mm 2500 sq. mm 2500 sq. mm
* Tab of device attached to topside copper
59°C/W
The LT1129 is designed to be stable with a wide range
of output capacitors. The minimum recommended value
THERMAL RESISTANCE
Table 3. S8 Package, 8-Lead Plastic SOIC
COPPER AREA
TOPSIDE* BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)
2500 sq. mm 2500 sq. mm 2500 sq. mm 55°C/W
1000 sq. mm 2500 sq. mm 2500 sq. mm 55°C/W
225 sq. mm 2500 sq. mm 2500 sq. mm 63°C/W
100 sq. mm 2500 sq. mm 2500 sq. mm 69°C/W
* Device attached to topside copper
T Package, 5-Lead TO-220
Thermal Resistance (Junction-to-Case) = 5°C/W
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input voltage
range of 4.5V to 5.5V, an output current range of 0mA to
500mA, and a maximum ambient temperature of 50°C,
what will the maximum junction temperature be?
is 3.3μF with an ESR of 2Ω or less. The LT1129 is a
micropower device and output transient response will
be a function of output capacitance. See the Transient
Response curves in the Typical Performance Character-
istics. Larger values of output capacitance will decrease
the peak deviations and provide improved output transient
response. Bypass capacitors, used to decouple individual
components powered by the LT1129, will increase the
effective value of the output capacitor.
Protection Features
The LT1129 incorporates several protection features
which make it ideal for use in battery-powered circuits.
In addition to the normal protection features associated
with monolithic regulators, such as current limiting and
thermal limiting, the device is protected against reverse
input voltages, and reverse voltages from output to input.
For ?xed voltage devices the output and sense pins are
tied together at the output.
112935ff
11
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