参数资料
型号: LT1175CS8#PBF
厂商: Linear Technology
文件页数: 2/20页
文件大小: 0K
描述: IC REG LDO NEG ADJ .5A 8SOIC
产品培训模块: More Information on LDOs
标准包装: 100
稳压器拓扑结构: 负,可调式
输出电压: -3.8 V ~ -19.9 V
输入电压: -4.3 V ~ -20 V
电压 - 压降(标准): 0.5V @ 500mA
稳压器数量: 1
电流 - 输出: 500mA
电流 - 限制(最小): 可调式
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
产品目录页面: 1326 (CN2011-ZH PDF)
LT1175
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Input Voltage (Transient 1 sec, Note 12) ...................25V
Input Voltage (Continuous) .......................................20V
Input-to-Output Differential Voltage (Note 13) ..........20V
5V SENSE Pin (with Respect to GND Pin) ......... 2V, –10V
ADJ SENSE Pin
(with Respect to OUTPUT Pin)...................20V, –0.5V
5V SENSE Pin
(with Respect to OUTPUT Pin)......................20V, –7V
Output Reverse Voltage ..............................................2V
SHDN Pin to GND Pin Voltage (Note 3) ........ 13.5V, –20V
SHDN Pin to V IN Pin Voltage .............................30V, –5V
Operating Junction Temperature Range (Note 2)
LT1175C ................................................. 0°C to 125°C
LT1175I .............................................. –40°C to 125°C
LT1175MP .......................................... –55°C to 125°C
Storage Temperature Range .................. –65°C to 150°C
Lead Temperature (Soldering, 10 sec)................... 300°C
PIN CONFIGURATION
TOP VIEW
FRONT VIEW
FRONT VIEW
V IN 1
8
V IN
5
SHDN
3
GND
I LIM2 2
OUTPUT 3
SENSE 4
7
6
5
I LIM4
SHDN
GND
TAB
IS
V IN
4
3
2
1
GND
V IN
SENSE
OUTPUT
TAB IS
V IN
2
1
V IN
OUTPUT
N8 PACKAGE
8-LEAD PDIP
θ JA = 80°C/W TO 120°C/W
DEPENDING ON PC BOARD LAYOUT
TOP VIEW
Q PACKAGE
5-LEAD PLASTIC DD-PAK
θ JA = 27°C/W TO 60°C/W
DEPENDING ON PC MOUNTING.
SEE DATA SHEET FOR DETAILS
ST PACKAGE
3-LEAD PLASTIC SOT-223
θ JA = 50°C/W
WITH BACKPLANE AND 10cm 2
TOPSIDE LAND SOLDERED TO TAB
V IN 1
8
V IN
I LIM2 2
7
I LIM4
FRONT VIEW
OUTPUT 3
SENSE 4
6
5
S8 PACKAGE
8-LEAD PLASTIC SO
SHDN
GND
5
4
3
2
1
SHDN
GND
V IN
SENSE
OUTPUT
θ JA = 60°C/W TO 100°C/W
DEPENDING ON PC BOARD LAYOUT
PINS 1, 8 ARE INTERNALLY CONNECTED TO DIE ATTACH PADDLE FOR HEAT SINKING.
ELECTRICAL CONTACT CAN BE MADE TO EITHER PIN. FOR BEST THERMAL RESISTANCE,
TAB IS
V IN
T PACKAGE
5-LEAD PLASTIC TO-220
θ JA = 50°C/W, θ JC = 5°C/W
PINS 1, 8 SHOULD BE CONNECTED TO AN EXPANDED LAND THAT IS OVER AN INTERNAL
OR BACKSIDE PLANE.
SEE APPLICATIONS INFORMATION
1175ff
2
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